hsdl-3002 Avago Technologies, hsdl-3002 Datasheet
hsdl-3002
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hsdl-3002 Summary of contents
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... IrDA® Data Compliant Low Power 115.2 kbit/s with Remote Control Transmission Infrared Transceiver Data Sheet Description The HSDL-3002 is a small form factor single enhanced infrared (IR) transceiver module that provides the combination of (1) interface between logic and IR signals for through-air, serial, half-duplex IR data link, and (2) IR remote control transmission operating at 940 nm for universal remote control applications ...
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... Application Support Information The Application Engineering Group is available to assist you with the application designs associated with the HSDL-3002 infrared transceiver module. You can contact them through your local sales representatives for additional details. Ordering Information Part Number Packaging Type HSDL-3002-007 Tape and Reel ...
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... R1 is used to optimize the performance of the 870 nm LED, while R2 is the current limiting resistor for the 940 nm RC LED. 2. CX1 must be placed within 0 HSDL-3002 to obtain optimum noise immunity environment with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in Figure 1. ...
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Transceiver I/O Truth Table Transceiver Mode Shutdown IrDA (TXD) Remote Control Input Active 0 Active 0 Active 0 Active 0 Active 0 Shutdown Don’t Care EI = In-Band Infrared Intensity at detector Notes: 4. In-Band EI 115.2 ...
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Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are with V otherwise noted. ...
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Notes in-band optical signal is a pulse/sequence where the peak wavelength, compliant with the IrDA Serial Infrared Physical Layer Link Specification. 8. For in band signals 2.4 kbps to 115.2 kbps where 3.6 W/cm 9. Latency is defined ...
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V OH 90% 50% 10 Figure 7. RXD output waveform. LED ON 90% 50% 10% LED OFF t r Figure 8. LED optical waveform. TXD LED t pw (MAX.) Figure 9. TXD “Stuck ON” protection. SD ...
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... HSDL-3002 Package Outline (with Integrated Shield) 0.885 1.35 2.65 1.25 2.95 1 COPLANARITY: +0.05 TO -0.15 0.80 Figure 12. Package outline dimension. 8 4.55 MOUNTING CENTER 9.10 ± 0.15 2.70 ± 0.15 2.60 5.80 1.55 R 1.50 R 1.10 3. 0.65 PITCH 1.00 0.50 ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.2 mm UNLESS OTHERWISE SPECIFIED. ...
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... HSDL-3002 Tape and Reel Dimensions 5.00° (MAX.) POLARITY PIN 8: GND 9.50 ± 0.10 PIN 1: VLED 0.40 ± 0.10 3.00 ± 0.10 MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT ACTIVATED ADHESIVE LABEL Figure 13. Tape and reel dimensions. 9 4.00 ± 0.10 1.13 ± 0.10 1.55 ± 0.05 +0.10 3.46 0 +0.10 3.30 0 8.00 ± 0.10 8.00° (MAX.) 3.40 ± ...
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... Moisture Proof Packaging All HSDL-3002 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 25°C, AND LESS THAN 60% RH? NO PACKAGE IS OPENED MORE THAN 72 HOURS ...
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... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed -3 C per second maximum. This limitation is necessary to allow the PC board and HSDL-3602 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL- 3602 transceiver. ...
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Appendix A : SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil STENCIL APERTURE SOLDER MASK Figure 16. Stencil and PCBA. 1.1 Recommended Land Pattern 2.65 0.715 1. 0.725 Figure 17. Land pattern. 12 ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and ...
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Appendix B : PCB Layout Suggestion The following shows an example of a PCB layout that would result in good electrical and EMI perfor- mance. Things to note: 1. The ground plane should be continuous under the part, but should ...
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... Turn on 870 nm LED only TxD V 400 mA Turn on 940 nm LED only TXD V Interface to Recommended I/O Chips The HSDL-3002’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb 115.2 kb/s is available at the RXD pin. The ...
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... W/ Based on a typical irradiance of 0.075 and turning on both 870 nm and 940 nm LEDs, a typical link distance achieved. For a more exhaustive note on implementing remote control using HSDL-3002, please refer to the application note. ...
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... In the figure below the width of the window the height of the window and Z is the distance from the HSDL-3002 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens 5.8 mm. The equations for ...
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Aperture Width (x, mm) Aperture Height (y, mm) Module Depth (z) mm Max. 0 15.73 1 16.89 2 18.04 3 19.19 4 20.35 5 21.5 6 22.66 7 23.81 8 24.97 9 26.12 APERTURE WIDTH (X) vs. MODULE DEPTH 30 ...
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Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be ...
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... For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5988-7424EN 5988-4165EN May 27, 2006 www ...