hsdl-3203 Avago Technologies, hsdl-3203 Datasheet

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hsdl-3203

Manufacturer Part Number
hsdl-3203
Description
Small Profile Package Irda Data Compliant Low Power 115.2 Kbit/s Infrared Transceiver - Agilent Hewlett-packard
Manufacturer
Avago Technologies
Datasheet

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Description
The HSDL-3203 is a miniature low
cost infrared transceiver module
that provides the interface between
logic and infrared (IR) signals for
through air, serial, half-duplex IR
data link. The module is compliant
to IrDA Physical Layer Specifica-
tions version 1.4 Low Power from
9.6 kbit/s to 115.2 kbit/s with
extended link distance and it is
IEC 825-Class 1 eye safe.
The HSDL-3203 can be shutdown
completely to achieve very low
power consumption. In the shut-
down mode, the PIN diode will be
inactive and thus producing very
little photocurrent even under very
bright ambient light. Such features
are ideal for battery operated
handheld products.
Agilent HSDL-3203
Small Profile Package
IrDA
115.2 kbit/s Infrared Transceiver
Data Sheet
Applications
• Mobile telecom
• Data communication
• Digital imaging
• Electronic wallet, IrFM
— Mobile phones
— Pagers
— Smart phone
— PDAs
— Portable printers
— Digital cameras
— Photo-imaging printers
®
Data Compliant Low Power
Features
• Fully compliant to IrDA 1.4 low
• Low power operation at extended
• Miniature package
• Guaranteed temperature
• Low power consumption
• Withstands > 100 mV
• V
• Integrated EMI shield
• LED stuck-high protection
• Designed to accommodate light
• IEC 825-Class 1 Eye Safe
• Lead-free and RoHS Compliant
power specification from
9.6 kbit/s to 115.2 kbit/s
link distance of 50 cm
— Height: 1.95 mm
— Width: 8.00 mm
— Depth: 3.10 mm
performance, –20 to +70˚C
— Critical parameters are
— Low shutdown current
— Complete shutdown of TXD,
supply ripple typically
loss with cosmetic windows
CC
guaranteed over temperature
and supply voltage
(10 nA typical)
RXD, and PIN diode
supply 2.7 to 3.6 volts
p-p
power

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hsdl-3203 Summary of contents

Page 1

... Description The HSDL-3203 is a miniature low cost infrared transceiver module that provides the interface between logic and infrared (IR) signals for through air, serial, half-duplex IR data link. The module is compliant to IrDA Physical Layer Specifica- tions version 1.4 Low Power from 9.6 kbit/s to 115.2 kbit/s with extended link distance and it is IEC 825-Class 1 eye safe ...

Page 2

... TXD 6.8 µF RXD 5 GND 4 AGND 100 nF Figure 1. Functional block diagram of HSDL-3203. 2 Ordering Information Part Number Packaging Type HSDL-3203-021 Tape and Reel LED DRIVER RX PULSE SHAPER Package Quantity Front View 2500 Figure 2. Rear view diagram with pin-out. ...

Page 3

... To obtain for LED LED 9. To obtain I of 250 mA for LED LED 10. C1 must be placed within 0 the HSDL-3203 to obtain optimum noise immunity. Transceiver I/O Truth Table Inputs TXD Light Input to Receiver High Don't Care Low High Low ...

Page 4

Absolute Maximum Ratings For implementation where case to ambient thermal resistance is Parameter Symbol Storage Temperature T S Operating Temperature LED Current I LED Peak LED Current I LED LED Anode Voltage V LEDA Supply Voltage V ...

Page 5

Electrical and Optical Specifications Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25˚C and 3.0 V unless otherwise noted. Parameter Symbol Min. Receiver ...

Page 6

V OH 90% 50% 10 Figure 3. RXD output waveform. LED ON 90% 50% 10% LED OFF t r Figure 4. LED optical waveform. TXD LED t pw (MAX.) Figure 5. TXD ‘Stuck On’ ...

Page 7

RADIANT INTENSITY vs ILED_A, TEMPERATURE = 25° 000.0E+0 100.0E-3 200.0E-3 300.0E-3 ILED_A (A) Figure 8. LOP vs. ILED. Package Outline with Dimensions MOUNTING CENTER 2.05 RECEIVER 2.85 3.1 1.85 UNIT: mm ...

Page 8

Tape and Reel Dimensions UNIT: mm 1.5 POLARITY PIN 8: LED A 8.4 ± 0.1 PIN 1: CX 3.4 ± 0.1 0.4 ± 0.05 2.8 ± 0.1 EMPTY PARTS MOUNTED (40 mm MIN.) LABEL Figure 11. Tape and reel dimensions. ...

Page 9

... Moisture-Proof Packaging All HSDL-3203 options are shipped in moisture-proof packaging. Once opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 25°C, AND LESS THAN 60% RH? NO PACKAGE IS OPENED MORE THAN 2 DAYS? YES PERFORM RECOMMENDED BAKING CONDITIONS Figure 12. Baking conditions chart. ...

Page 10

... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed 6 C per second maximum. This limitation is nec- essary to allow the PC board and HSDL-3203 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3203 transceiver. ...

Page 11

Appendix A : SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 14. Stencil and PCBA. 1.1 Recommended Land Pattern MOUNTING CENTER 0.10 1.75 0.60 UNIT: mm Figure 15. Land pattern. ...

Page 12

Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure ad- equate printed solder paste vol- ...

Page 13

Appendix B: PCB Layout Suggestion The following shows an example of a PCB layout using option #021 that would result in good electrical and EMI performance. Things to note: 1. The ground plane should be continuous under the part, but ...

Page 14

... Appendix C: General Application Guide for the HSDL-3203 Infrared IrDA Compliant 115.2 kb/s Transceiver Description The HSDL-3203, a wide voltage operating range infrared transceiver low-cost and small form factor device that is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones ...

Page 15

... CONTROLLER RS232C DRIVER PDA PLATFORM Figure 20. IR layout in PDA platform. The link distance testing was done using typical HSDL-3203 units with National Semiconductor’s PC87109 3V Super I/O controller and SMC’s FDC37C669 and FDC37N769 Super I/O controllers link distance 100 cm was demonstrated ...

Page 16

... Z is the distance OPAQUE MATERIAL Z IR TRANSPARENT WINDOW 1 6 from the HSDL-3203 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens 5.1 mm. The equations for computing the window dimen- sions are as follows: ...

Page 17

Module Depth Aperture Width (x, mm) (z) mm Max. 0 8.76 1 9.92 2 11.07 3 12.22 4 13.38 5 14.53 6 15.69 7 16.84 8 18.00 9 19.15 APERTURE WIDTH (X) vs MODULE DEPTH ...

Page 18

Window Material Almost any plastic material will work as a window material. Poly- carbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make ...

Page 19

For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 ...

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