hsdl-3210 Avago Technologies, hsdl-3210 Datasheet
hsdl-3210
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hsdl-3210 Summary of contents
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... Description The HSDL-3210 is one of a new generation of low-cost Infrared (IR) transceiver modules from Agilent Technologies. It features one of the smallest footprint in the industry 3.0 D mm. Although the supply voltage can range from 2 3.6 V, the LED is driven by an internal constant current source SIR data rates and 150 mA at MIR data rates ...
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... C1 6.8 µF TXD/SWDAT 7 RXD/SRDAT SCLK I 1.0 µF C3 GND 1 0.47 µF Figure 1. Functional block diagram of HSDL-3210. I/O Pin Configuration Table Pin Symbol Description 1 GND Ground 2 IOV Input/Output Supply Voltage CC 4 SCLK Serial Clock 5 SD Shut Down Active High 6 RXD/SRDAT Receiver Data Output ...
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... F, 20%, Tantalum C2 1.0 F, 20%, Tantalum C3 0.47 F, 20%, Ceramic Note: 1. C1, which is optional, must be placed within 0 the HSDL-3210 to obtain optimum noise immunity. Serial Interface for Transceiver Control The Serial Interface for Transceiver Control (STC) is used to control and program the features of the transceiver. These ...
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Table 2. Serial Interface for Transceiver Control – Read Data Format IrDA Data –data rates SIR (2.4 to 115.2 Kbps) MIR (0.576, 1.152 Mbps) I/O Control SD Normal Mode SD Sleep Mode RXD disable RXD enable TXD disable TXD enable ...
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Caution: The BiCMOS inherent to this design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or ...
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Electrical and Optical Specifications Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values are and 3.0 V unless otherwise noted. Parameter Receiver RXD ...
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V OH 90% 50% 10 Figure 4. RXD output waveform. t LED ON 90% 50% 10% LED OFF t r Figure 5. LED optical waveform. TXD LED t pw (MAX.) Figure 6. TXD ‘Stuck ...
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Package Dimensions MOUNTING 2.05 RECEIVER 1.175 2.85 3.0 1.85 0.6 Figure 9. Package outline dimensions. 8 4.0 CENTER 1.025 C L EMITTER 2.2 2.5 1.05 1.25 2.55 4.0 8.0 2 PIN 1 3.325 6.65 0.35 COPLANARITY ...
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Tape and Reel Dimensions 4.0 ± 0.1 UNIT: mm 1.5 POLARITY PIN 8: LED A 8.4 ± 0.1 PIN 1: CX 3.4 ± 0.1 0.4 ± 0.05 2.8 ± 0.1 EMPTY PARTS MOUNTED (40 mm MIN.) DETAIL A LABEL Figure ...
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... Moisture-Proof Packaging All HSDL-3210 options are shipped in moisture-proof packaging. Once opened, moisture absorption begins. This product is compliant to JEDEC level 4. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 25°C, AND LESS THAN 60% RH? NO PACKAGE IS OPENED MORE THAN 72 HOURS? YES ...
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... The cool down rate, R5, from the liquidus point of the solder (77 F) should not exceed –3 C per sec- ond maximum. This limitation is necessary to allow the PC board and HSDL-3210 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3210 transceiver. ...
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Appendix A : SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 13. Stencil and PCBA. 1.1 Recommended Land Pattern MOUNTING CENTER 0.10 1.75 0.60 UNIT: mm Figure 14. Land pattern. ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure ad- equate printed solder paste vol- ...
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... V , the LED CC connection should be before the C1 cap. A reference layout of a 2-layer Agilent evaluation board for HSDL-3210 based on the guidelines stated above is shown below. For more details, please refer to Agilent Application Note 1114, Infrared Transceiver PC Board Layout for Noise Immunity. ...
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... APPLICATION TOUCH PANEL COM PORT PDA PLATFORM Interface to Recommended I/O chips The HSDL-3210’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb 1.152 Mbp/s is available at the RXD pin. The block diagram below shows how the IR port fits into a mobile phone and PDA platform ...
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... INFRARED CONTROLLER (MASTER) STC – COMMAND / RESPONSE MODE The link distance testing was done using typical HSDL-3210 units with National Semiconductor’s PC87109 3V Super I/O controller and SMC’s FDC37C669 and FDC37N769 Super I/O controllers link distance was demon- strated for SIR at full power. On the other hand, for MIR at full power link distance was demonstrated ...
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... Y IR TRANSPARENT WINDOW Z D Figure 20. Window design diagram from the HSDL-3210 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens 5.1 mm. The equations for computing the window dimen- sions are as follows 2*(Z + D)*tanA ...
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Module Depth Aperture Width (x, mm) (z) mm Max. Min. 0 8.76 6.80 1 9.92 7.33 2 11.07 7.87 3 12.22 8.41 4 13.38 8.94 5 14.53 9.48 6 15.69 10.01 7 16.84 10.55 8 18.00 11.09 9 19.15 11.62 ...
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Window Material Almost any plastic material will work as a window material. Poly- carbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make ...
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For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 ...