hsdl-3211 Avago Technologies, hsdl-3211 Datasheet

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... Data Compliant Low Power 1.15 Mbit/s ® Infrared Transceiver Data Sheet Description The HSDL-3211 is a new generation low profile high speed infrared transceiver module that provides interface between logic and IR signals for through- air, serial, half-duplex IR data-link. The module is fully compliant to IrDA Physical Layer specification version 1 ...

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... Connect to system ground via a low inductance trace. For best performance, do not connect directly to the transceiver pin GND 10. CX1 must be placed within 0 the HSDL-3211 to obtain optimum noise immunity. 11. In environments with noisy power supplies, including CX2, as shown in Figure 1, can enhance supply ripple rejection performance. ...

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CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or ...

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Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to 3.0V and ...

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V OH 90% 50% 10 Figure 3. RxD output waveform. TXD LED t pw (MAX.) Figure 5. TxD “Stuck On” protection waveform. 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 1.4 1.5 ...

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... HSDL-3211 Package Dimensions 2.0 0.8 0.4 6 ...

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... HSDL-3211 Tape and Reel Dimensions Unit: mm 1.5 POLARITY Pin 8: GND Pin 1: LEDA 8.4 ± 0.1 0.4 ± 0.05 3.4 ± 0.1 2.8 ± 0.1 Empty Parts Mounted (40mm min) LABEL Note: The carrier tape is compliant to the packaging materials standards for ESD sensitive device, EIA-541 7 4.0 ± 0.1 1.5 ± 0.1 +0.1 0 8.0 ± 0.1 Progressive Direction Leader ...

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... Moisture Proof Packaging All HSDL-3211 options are shipped in moisture proof package. Once opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30°C, AND LESS THAN YES NO BAKING OPENED LESS IS NECESSARY THAN 72 HOURS PERFORM RECOMMENDED BAKING CONDITIONS Figure 9 ...

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... The cool down rate, R5, from the liquidus point of the solder to 25° C (77° F) should not exceed 6° C per second maximum. This limitation is necessary to allow the PC board and HSDL-3211 castellations to change dimensions evenly, putting minimal stresses on the HSDL-3211 transceiver. ...

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Appendix A: SMT Assembly Application Note Solder Pad, Mask and Metal Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 10. Stencil and PCBA. Recommended Land Pattern C L 1.35 MOUNTING CENTER 0.10 1.75 0.60 0.475 1.425 UNIT: mm Figure 11. Stencil ...

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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no ...

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Appendix B: PCB Layout Suggestion The following PCB layout guide- lines should be followed to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: 1. The ground plane should be continuous under the part, ...

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... Appendix C: General Application Guide for the HSDL-3211 Description The HSDL-3211, a low-cost and small form factor infrared trans- ceiver, is designed to address the mobile computing market such as PDAs, as well as small-embedded mobile products such as digital cameras and cellular phones fully compliant to IrDA 1.4 low power specification from 9 ...

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... FOR EMBEDDED APPLICATION PCMCIA CONTROLLER RS232C DRIVER Figure 16. PDA platform. The link distance testing was done using typical HSDL-3211 units with SMC’s FDC37C669 and FDC37N769 Super I/O controllers link distance was demonstrated for SIR and MIR at full power ...

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... Appendix D: Window Designs for HSDL-3211 Optical port dimensions for HSDL-3211 To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maxi- mum dimensions minimize the effects of stray light ...

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Module Depth Aperture Width (x, mm) (z) mm Max. 0 8.76 1 9.92 2 11.07 3 12.22 4 13.38 5 14.53 6 15.69 7 16.84 8 18.00 9 19.15 APERTURE WIDTH (X) vs. MODULE DEPTH ...

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Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture filter dye may be used in the window to make it ...

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... For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved. 5988-9887EN August 22, 2006 ...