hsdl-2100 ETC-unknow, hsdl-2100 Datasheet - Page 10

• Manufacturer Part Number: hsdl-2100
• Description: Compliant Transceiver
• Manufacturer: ETC-unknow

The Temperature Profile for a Nominal Convective IR Reflow Solder Process
See the Table below for
Figure 4.
Thermal Derating Curves
These 2 graphs show maximum allowable LED drive current as a function of ambient temperature and the
designer’s PCB-to-ambient thermal resistance.
230
200
183
170
150
125
100
100
-20
50
25
80
60
40
20
SOLDER PASTE DRY
0
SOLDER REFLOW
0
PROCESS ZONE
COOL DOWN
0
HEAT UP
HEAT UP
LED DRIVE CURRENT (A)
R1
15
P1
0.2
TABLE FOR CONVECTIVE PROCESS ZONES, SEE FIGURE 4.
30
0.4
45
SOLDER PASTE DRY
60
SYMBOL
P4, R5
P1, R1
P2, R2
P3, R3
R4
0.6
Temperature (RX) Values.
R2
75
P2
t-TIME (SECONDS)
90
0.8
170°C TO 230°C (235°C MAX.)
105
JUNCTION TO CASE MEASUREMENTS FOR HSDL-2100
125°C TO 170°C
230°C TO 170°C
25°C TO 125°C
170°C TO 25°C
120
I
R3
F
0.45
0.55
0.65
0.75
0.4
0.5
0.6
0.7
REFLOW
SOLDER
THbd–amb = 50 C/W
THbd–amb = 100 C/W
THbd–amb = 150 C/W
THbd–amb = 200 C/W
THbd–amb = 250 C/W
THbd–amb = 300 C/W
(A)
90 sec.
ABOVE
135
183°C
MAX.
T
P3
150
R4
165 180
COOL DOWN
MAX. CASE TEMPERATURE (°C)
P4
0.5°C/s MAX.
-4°C/s TYP.
-3°C/s MAX.
3°C/s MAX.
4°C/s TYP.
R5
195
T/ TIME
101.3
98.4
95.3
92.1
88.7
85.2
81.6
77.9
210
10
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
20
CASE TEMPERATURE (°C)
40
60
80
100
120