cbt3244ads NXP Semiconductors, cbt3244ads Datasheet
cbt3244ads
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cbt3244ads Summary of contents
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CBT3244A Octal bus switch with quad output enables Rev. 02 — 15 September 2005 1. General description The CBT3244A provides eight bits of high-speed TTL-compatible bus switching in a standard '244 device pinout. The low ON-state resistance of the switch ...
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... Type number Topside Package mark Name CBT3244ABQ CT3244A DHVQFN20 plastic dual in-line compatible thermal enhanced very thin quad flat CBT3244APW CT3244A TSSOP20 CBT3244ADS CT3244ADS SSOP20 CBT3244ADB CT3244A SSOP20 CBT3244AD CBT3244AD SO20 [1] Also known as QSOP20. Standard packing quantities and other packaging data are available at www ...
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... 1A1 2OE 3 18 2B4 1B1 1A2 4 17 2A4 2B3 5 16 1B2 CBT3244ADS 6 15 1A3 2A3 2B2 7 14 1B3 1A4 8 13 2A2 9 12 2B1 1B4 10 11 2A1 002aab652 (QSOP) Rev. 02 — 15 September 2005 CBT3244A Octal bus switch with quad output enables ...
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Philips Semiconductors (1) The die substrate is attached to this pad using conductive die attach material. It cannot be Fig 6. Pin configuration for DHVQFN20 5.2 Pin description Table 2: Symbol 1OE 1A1, 1A2, 1A3, 1A4 2A1, 2A2, 2A3, 2A4 ...
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Philips Semiconductors 6. Functional description Refer to 6.1 Function table Table HIGH voltage level LOW voltage level high-impedance OFF state Inputs 1OE Limiting values Table 4: In accordance ...
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Philips Semiconductors 9. Static characteristics Table 6: Static characteristics +85 C amb Symbol Parameter V input clamping voltage IK I input leakage current LI I quiescent supply current CC [2] I additional quiescent supply current ...
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Philips Semiconductors 10.1 AC waveforms and t PLZ t and t PZL t and t PLH Fig 7. Input to output propagation delays (1) Waveform 1 is for an output with internal conditions ...
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Philips Semiconductors 11. Test information Fig 9. Test circuit Table 8: Test PLZ PZL t /t PHZ PZH 9397 750 13362 Product data sheet from output under test Test data are given inTable 8. All input ...
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Philips Semiconductors 12. Package outline DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm terminal 1 index area terminal 1 index area ...
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Philips Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...
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Philips Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) A UNIT ...
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Philips Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1.80 mm ...
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Philips Semiconductors SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...
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Philips Semiconductors 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...