at88sa100s ATMEL Corporation, at88sa100s Datasheet - Page 19

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at88sa100s

Manufacturer Part Number
at88sa100s
Description
Battery Authentication Chip
Manufacturer
ATMEL Corporation
Datasheet
6.
8558B–SMEM–09/09
Package Drawing
3TS1 - Shrink SOT
Notes:
R
1.
2. The package top may be smaller than the package bottom. Dimen-
3. These dimensions apply to the flat section of the lead bet w een 0.08
Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.25 mm per
end. Dimension E1 does not include interlead flash or protrusion.
Interlead flash or protrusion shall not exceed 0.25 mm per side.
sions D and E1 are determined at the outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash, but including any mismatch between the top and
bottom of the plastic body.
mm and 0.15 mm from the lead ti p .
This drawing is for general information only. Refer to JEDEC Drawing
TO-236, Variation AB for additional information.
Package Drawing Contact:
packagedrawings@atmel.com
SEATING
PLANE
E1
1
Top View
Side View
TITLE
3TS1, 3-lead, 1.30 mm Bo dy, PlasticThin
Shrink Small OutlinePackage (Sh rink SOT)
e1
3
D
e
b
2
A2
A1
E
A
AT88SA100S [ Preliminary]
SYMBOL
End View
A
A1
A2
D
E
E1
L1
e1
b
0.89
0.01
0.88
2.80
2.10
1.20
0.30
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
C L
GPC
TBG
1.90 BSC
0.54 REF
2.90
1.30
NOM
-
-
-
-
-
DRAWING NO.
1.12
0.10
1.02
3.04
2.64
1.40
0.50
MAX
3TS1
NOTE
1,2
1,2
11/5/08
3
REV.
A
19

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