w25q80bv Winbond Electronics Corp America, w25q80bv Datasheet - Page 63

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w25q80bv

Manufacturer Part Number
w25q80bv
Description
8m-bit Serial Flash Memory With Dual And Quad Spi
Manufacturer
Winbond Electronics Corp America
Datasheet

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DESCRIPTION
/HOLD Active Hold Time relative to CLK
/HOLD Not Active Setup Time relative to CLK
/HOLD Not Active Hold Time relative to CLK
/HOLD to Output Low-Z
/HOLD to Output High-Z
Write Protect Setup Time Before /CS Low
Write Protect Hold Time After /CS High
/CS High to Power-down Mode
/CS High to Standby Mode without Electronic
Signature Read
/CS High to Standby Mode with Electronic Signature
Read
/CS High to next Instruction after Suspend
Write Status Register Time
Byte Program Time (First Byte)
Additional Byte Program Time (After First Byte)
Page Program Time
Sector Erase Time (4KB)
Block Erase Time (32KB)
Block Erase Time (64KB)
Chip Erase Time
11.7 AC Electrical Characteristics (
Notes:
1.
2.
3.
4.
Clock high + Clock low must be less than or equal to 1/f
Value guaranteed by design and/or characterization, not 100% tested in production.
Only applicable as a constraint for a Write Status Register instruction when SRP0 bit is set to 1.
For multiple bytes after first byte within a page,
number of bytes programmed.
(4)
cont’d)
(4)
t
BPN
=
- 63 -
SYMBOL
C
t
t
t
t
t
t
t
BP1 +
WHSL
SHWL
HHQX
RES
RES
t
.
HLQZ
t
t
t
t
SUS
CHHH
HHCH
CHHL
DP
t
t
t
t
t
t
t
BE
BE
t
BP1
BP2
CE
PP
SE
W
(2)
1
2
t
(2)
1
2
(2)
(2)
(2)
(2)
(3)
(3)
BP2 * N
(typical) and
ALT
t
t
HZ
LZ
Publication Release Date: March 26, 2009
MIN
100
20
5
5
5
t
BPN
=
t
TYP
BP1 +
SPEC
120
150
2.5
0.7
10
30
30
2
Preliminary - Revision A
W25Q80BV
t
BP2 * N
1,000
MAX
200
800
(max), where N =
1.8
12
20
15
50
12
7
3
3
3
6
UNIT
ms
ms
ms
ms
ms
µs
µs
µs
µs
µs
µs
ns
ns
ns
ns
ns
ns
ns
s

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