tza3013b NXP Semiconductors, tza3013b Datasheet

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tza3013b

Manufacturer Part Number
tza3013b
Description
Sdh/sonet Stm16/oc48 Transimpedance Amplifier
Manufacturer
NXP Semiconductors
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
tza3013bU/N3
Manufacturer:
AVAGO
Quantity:
1 060
Part Number:
tza3013bU/N3
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Product specification
Supersedes data of 2000 Jun 19
File under Integrated Circuits, IC19
DATA SHEET
TZA3013A; TZA3013B
SDH/SONET STM16/OC48
transimpedance amplifier
INTEGRATED CIRCUITS
2001 Feb 26

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tza3013b Summary of contents

Page 1

... DATA SHEET TZA3013A; TZA3013B SDH/SONET STM16/OC48 transimpedance amplifier Product specification Supersedes data of 2000 Jun 19 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 2001 Feb 26 ...

Page 2

... TZA3013BU bare die in waffle pack carriers; die dimensions 0.810 2001 Feb 26 TZA3013A; TZA3013B APPLICATIONS Digital fibre optic receiver in short, medium and long haul optical telecommunications transmission systems or in high speed data networks Wide-band RF gain block ...

Page 3

... IN 2 GNDA Fig.1 Block diagram of TZA3013AU (bare die only). handbook, full pagewidth V CC 100 pF 270 DREF GNDA Fig.2 Block diagram of TZA3013BU (bare die only). 2001 Feb 26 AGC PILOT 4 12 GAIN PEAK CONTROL DETECTOR TZA3013AU low noise single-ended to amplifier differential converter ...

Page 4

... OUTQ; note 2 5 analog data sense output for OUT; for test purposes output 15 supply supply voltage 4 Product specification TZA3013A; TZA3013B DESCRIPTION ...

Page 5

... The data output circuit is shown in Fig.3. The logic level symbol definitions are shown in Fig. OUT OUTQ 16 16 Fig.3 Data output circuit OQL Product specification TZA3013A; TZA3013B 2 k OUTQSENSE MGT102 o(p-p) MGR243 ...

Page 6

... V CC handbook, halfpage 30 TZA3013 MGU120 negative supply Fig.6 The PIN diode connected between the input and a negative supply voltage. 6 Product specification TZA3013A; TZA3013B 0.862 V preferable DREF 270 TZA3013 MGT103 ...

Page 7

... Fig.7 AGC characteristics. 7 Product specification TZA3013A; TZA3013B < 1.7mA). The AGC allows the amplifier to i and function of DC input OUT OUTQ ) at a supply voltage of 3 ...

Page 8

... V; minimum and maximum values are valid over the entire ambient CONDITIONS AC-coupled without input signal measured differentially; AC-coupled 0 referenced to input 1.8 GHz third-order i Bessel filter; note 1 8 Product specification TZA3013A; TZA3013B MIN. MAX. 0.5 +3.8 0.5 +2 4.0 +4.0 10 +10 ...

Page 9

... A (p-p) i single-ended; DC tested 20% to 80% 80% to 20% = 0.5 pF comprising 0.4 pF (photodiode) and 0.1 pF (allowed for PCB layout corresponding to change in supply voltage ( MHz will typically add an extra 120 Product specification TZA3013A; TZA3013B MIN. TYP. MAX 240 270 340 1700 ...

Page 10

... V CC ( Fig.11 Input bias voltage as a function of the 10 Product specification TZA3013A; TZA3013B 3.0 3.2 3 (V) Supply current as a function of the supply voltage. (1) (2) ( 120 3 3 3.0 V. junction temperature. ...

Page 11

... V o(cm) (mV) (1) (2) 300 260 220 180 3.4 3 (V) (1) V (2) V (3) V Fig.13 Common mode output voltage as a function . CC 11 Product specification TZA3013A; TZA3013B (1) (2) ( 120 the junction temperature referenced MGT110 ...

Page 12

... 100 nF OUT 10 nF 330 IN TZA3013 R OUTQ 60 100 nF GND Fig.15 Test circuit. 12 Product specification TZA3013A; TZA3013B transmission line 100 100 MGT112 PORT SAMPLING OSC 1 trigger input MGT113 2 ...

Page 13

... Product specification TZA3013A; TZA3013B (1) COORDINATES y +155 +10 157 255 255 +255 255 +255 255 255 79 +70 +255 +255 +255 255 +255 255 +255 ...

Page 14

... C; recommended die attach is glue Attach time <15 s 2001 Feb 26 handbook, halfpage DREF GNDD 810 IN 9 TESTC m INQ 7 8 MGT101 Fig.17 Bonding pad locations of the TZA3013BU. VALUE 1.230 mm (0.996 Product specification TZA3013A; TZA3013B TZA3013BU 10 GNDD x ...

Page 15

... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 15 Product specification TZA3013A; TZA3013B (1) Philips Semiconductors ...

Page 16

Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...

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