tza3001ahl NXP Semiconductors, tza3001ahl Datasheet - Page 23
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
tza3001ahl
Manufacturer Part Number
tza3001ahl
Description
Sdh/sonet Stm4/oc12 Laser Drivers
Manufacturer
NXP Semiconductors
Datasheet
1.TZA3001AHL.pdf
(32 pages)
- Current page: 23 of 32
- Download datasheet (148Kb)
Philips Semiconductors
BONDING PAD LOCATIONS
2002 Aug 13
GND
MONIN
GND
IGM
TONE
TZERO
BGAP
V
V
GND
GND
V
V
GND
LAQ
LA
GND
BIAS
GND
GND
GND
ALARMHI
SYMBOL
CC(G)
CC(G)
CC(B)
CC(B)
SDH/SONET STM4/OC12 laser drivers
PAD
10
11
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
+244
+384
+524
+664
+910
+910
+910
+910
+910
+910
+910
+910
+910
+910
+681
+541
COORDINATES
+87
664
524
367
227
x
70
+210
+350
+490
+630
+910
+910
+70
910
910
910
910
910
910
910
910
910
910
630
490
350
210
y
70
(1)
23
Note
1. All x and y coordinates represent the position of the
V
DLOOP
DLOOPQ
V
ALARMLO
ONE
ZERO
GND
GND
ALARM
ENL
V
DIN
DINQ
V
ALS
GND
GND
CC(R)
CC(R)
CC(R)
CC(R)
SYMBOL
centre of the pad in m with respect to the centre of the
die (see Fig.20).
TZA3001AHL; TZA3001BHL;
PAD
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
+384
+227
COORDINATES
+87
210
367
524
681
910
910
910
910
910
910
910
910
910
910
x
70
Product specification
TZA3001U
+910
+910
+910
+910
+910
+910
+910
+910
+681
+541
+384
+227
+70
227
367
551
664
y
70
(1)
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