l6706 STMicroelectronics, l6706 Datasheet - Page 9
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l6706
Manufacturer Part Number
l6706
Description
Vr11.1 Single Phase Controller With Integrated Driver
Manufacturer
STMicroelectronics
Datasheet
1.L6706.pdf
(47 pages)
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L6706
2.2
Table 2.
Thermal data
Table 3.
PAD
N°
39
40
Symbol
R
T
R
T
MAX
thJC
T
thJA
stg
J
Thermal
UGATE
BOOT
Name
PAD
Pin description (continued)
Thermal data
Thermal resistance junction to ambient
(Device soldered on 2s2p PC board)
Thermal resistance junction to case
Maximum junction temperature
Storage temperature range
Junction temperature range
HS driver output.
It must be connected to the HS MOSFET gate. A small series resistors helps in
reducing device-dissipated power.
HS driver supply.
Connect through a capacitor (100 nF typ.) to PHASE and provide necessary
Bootstrap diode. A small resistor in series to the boot diode helps in reducing
Boot capacitor overcharge.
Exposed pad connects the silicon substrate. As a consequence it makes a
good thermal contact with the PCB to dissipate the power necessary to drive
the external MOSFETs.
Connect it to the power ground plane using 4.3 x 4.3 mm square area on the
PCB and with nine vias, to improve thermal conductivity.
Doc ID 15698 Rev 1
Parameter
Pins description and connection diagrams
Description
-40 to 150
0 to 125
Value
150
35
1
°C / W
°C / W
Unit
°C
°C
°C
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