mc9s08dz32amlfr Freescale Semiconductor, Inc, mc9s08dz32amlfr Datasheet - Page 18

• Manufacturer Part Number: mc9s08dz32amlfr
• Description: Hcs08 Microcontrollers
• Manufacturer: Freescale Semiconductor, Inc

Section Number
17.1 Introduction ....................................................................................................................................379
17.2 Background Debug Controller (BDC) ...........................................................................................380
17.3 Register Definition .........................................................................................................................387
18.1 Introduction ....................................................................................................................................393
18.2 Signal Description ..........................................................................................................................394
18.3 Memory Map and Registers ...........................................................................................................395
18.4 Functional Description ...................................................................................................................410
18.5 Resets .............................................................................................................................................416
18.6 Interrupts ........................................................................................................................................417
18.7 Electrical Specifications .................................................................................................................417
A.1 Introduction ...................................................................................................................................419
A.2 Parameter Classification ................................................................................................................419
A.3 Absolute Maximum Ratings ..........................................................................................................419
A.4 Thermal Characteristics .................................................................................................................420
18
17.1.1 Forcing Active Background ............................................................................................379
17.1.2 Features ...........................................................................................................................380
17.2.1 BKGD Pin Description ...................................................................................................381
17.2.2 Communication Details ..................................................................................................381
17.2.3 BDC Commands .............................................................................................................385
17.2.4 BDC Hardware Breakpoint .............................................................................................387
17.3.1 BDC Registers and Control Bits .....................................................................................388
17.3.2 System Background Debug Force Reset Register (SBDFR) ..........................................390
18.1.1 Features ...........................................................................................................................393
18.1.2 Modes of Operation ........................................................................................................394
18.1.3 Block Diagram ................................................................................................................394
18.3.1 Module Memory Map .....................................................................................................395
18.3.2
18.3.3 Register Descriptions ......................................................................................................397
18.4.1 Comparator .....................................................................................................................410
18.4.2 Breakpoints .....................................................................................................................411
18.4.3 Trigger Selection .............................................................................................................411
18.4.4 Trigger Break Control (TBC) .........................................................................................412
18.4.5 FIFO ................................................................................................................................415
18.4.6 Interrupt Priority .............................................................................................................416
Debug Module (S08DBGV3) (128K)
MC9S08DZ128 Series Data Sheet, Rev. 1
Electrical Characteristics
Development Support
Appendix A
Chapter 17
Chapter 18
Title
Freescale Semiconductor
Page
396