ft232hq Future Technology Devices International Ltd., ft232hq Datasheet - Page 64

• Manufacturer Part Number: ft232hq
• Description: Ft232h Single Channel Hi- Speed Usb To Multipurpose Uart/fifo Ic
• Manufacturer: Future Technology Devices International Ltd.

Table 8.1 Reflow Profile Parameter Values
Table 8.2 Package Reflow Peak Temperature
SnPb Eutectic and Pb free (non green material)
Pb Free (green material) = 260 +5/-0 deg C
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
Time for T= 25°C to Peak Temperature, T
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Package Thickness
Profile Feature
Ramp Down Rate
≥
- Time (t
< 2.5 mm
Preheat
s
2.5 mm
Min to t
(t
T
L
p
:
)
Copyright © 2011 Future Technology Devices International Limited
L
)
s
Max)
s
s
L
)
Min.)
Max.)
FT232H SINGLE CHANNEL HI-SPEED USB TO MULTIPURPOSE UART/FIFO IC
s
p
)
to T
p
)
p
Pb Free Solder Process
Volume mm3 < 350
(green material)
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
235 +5/-0 deg C
220 +5/-0 deg C
30 to 40 seconds
8 minutes Max.
150°C
200°C
217°C
260°C
SnPb Eutectic and Pb free (non
green material) Solder Process
Volume mm3 >=350
Document No.: FT_000288
Clearance No.: FTDI #199
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
220 +5/-0 deg C
220 +5/-0 deg C
20 to 40 seconds
6 minutes Max.
Datasheet Version 1.0
100°C
150°C
183°C
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