sc16c754bibm NXP Semiconductors, sc16c754bibm Datasheet - Page 48

• Manufacturer Part Number: sc16c754bibm
• Description: 5 V, 3.3 V And 2.5 V Quad Uart, 5 Mbit/s Max. With 64-byte Fifos
• Manufacturer: NXP Semiconductors

Philips Semiconductors
14. Revision history
Table 28:
9397 750 14668
Product data sheet
Document ID
SC16C754B_2
Modifications:
SC16C754B_1
Revision history
Release date
20050613
20050127
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[4]
[5]
[6]
[7]
[8]
[9]
Section 1 “General
Section 2
Table 1 “Ordering
Figure 2 “Pin configuration for LQFP64”
Table 2 “Pin
– added column for LQFP64 pinning
– descriptions for CLKSEL, INTSEL, RXRDY, TXRDY modified to indicate the package-type to
Table 10 “SC16C754B internal
note 2
Table 24 “Limiting
Table 25 “Static
– description following title changed from ‘V
– Added ‘V
–
Table 26 “Dynamic
– symbol ‘t
– under values for t
– symbol N: removed ‘RCLK cycle(s)’ from values (N is a number)
– added (new)
Figure 25 “Package outline SOT414-1 (LQFP64)”
Section 18 “Trademarks”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
which they apply
‘Tolerance of V
Table note
Table note
“Features”, 4th bullet: changed ‘baud rate’ to ‘data rate’ (2 places)
Data sheet status
Product data sheet
Product data sheet
3w
description”:
CC
5: changed ‘x
’ changed to ‘f
3; added unit ‘ns’
=’ to value limits column headings
characteristics”:
Table note 2
information”: added LQFP64 package offering
CC
values”: table note removed (statement shown in
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs
characteristics”:
description”, 3rd paragraph: added ‘LQFP64’
20d
10 %; unless otherwise specified.’
Rev. 02 — 13 June 2005
, t
23d
added
2
, t
XTAL
’ to ‘XTAL2’
25d
registers”: shading removed, replaced with reference to
’; added reference to (new)
, t
28d
Change notice
-
-
: changed ‘RCLK cycles’ to ‘T
added
CC
= 2.5 V, 3.3 V
added
Doc. number
9397 750 14668
9397 750 13114
Table note 2
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
10 % or 5 V
RCLK
Section 17
SC16C754B
’; added reference to
Supersedes
SC16C754B_1
-
10 %’ to
“Disclaimers”)
Table
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