LMK03000 National Semiconductor Corporation, LMK03000 Datasheet - Page 23

• Manufacturer Part Number: LMK03000
• Manufacturer: National Semiconductor Corporation

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FIGURE 3. Recommended Land and Via Pattern
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground plane layer is not
exposed). This is done by including a copper area of about 2 square inches on the opposite side of the PCB from the LMK0300XX.
This copper area may be plated or solder coated to prevent corrosion but should not have conformal coating (if possible), which
could provide thermal insulation. The vias shown in Figure 3 should connect these top and bottom copper layers and to the ground
layer. These vias act as “heat pipes” to carry the thermal energy away from the device side of the board to where it can be more
effectively dissipated.
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