hsp50215 Intersil Corporation, hsp50215 Datasheet - Page 19
![no-image](/images/manufacturer_photos/0/3/342/intersil_corporation_sml.jpg)
hsp50215
Manufacturer Part Number
hsp50215
Description
Digital Upconverter
Manufacturer
Intersil Corporation
Datasheet
1.HSP50215.pdf
(21 pages)
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input, Output or I/O Voltage . . . . . . . . . . . .GND -0.5V to V
Typical De-rating Factor . . . . . . . . . . . . 2mA/MHz Increase in I
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V
Temperature Range
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to V
Input Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . 1V/ns Max
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
DC Electrical Specifications
NOTES:
Logical One Input Voltage
Logical Zero Input Voltage
Clock Input High
Clock Input Low
Output High Voltage
Output Low Voltage
Input Leakage Current
Output Leakage Current
Standby Power Supply Current
Operating Power Supply Current
(Commercial)
Operating Power Supply Current (In-
dustrial)
Input Capacitance
Output Capacitance
2.
3. Power Supply current is proportional to operation frequency. Typical rating for I
4. Capacitance T
Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
cess or design changes.
JA
is measured with the component mounted on an evaluation PC board in free air.
PARAMETER
A
= 25
o
C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major pro-
3-440
V
SYMBOL
CC
I
I
I
C
CCOP
CCOP
V
CCSB
V
V
V
C
V
V
OUT
IHC
I
= 5 5%, T
IHL
I
OH
OL
O
IH
L
IN
IL
o
o
C to 70
C to 85
V
V
V
V
I
I
V
V
V
f = 52MHz, V
V
f = 48MHz, V
V
Freq = 1MHz, V
Referenced To Device Ground
A
CC
OH
OL
CC
CC
CC
CC
IN
IN
CC
CC
CC
= 0
= +2.0mA, V
+0.5V
CCOP
= V
= V
= -400 A, V
= 5.25V
= 4.75V
= 5.25V
= 4.75V
= 5.25V, Outputs Not Loaded
= 5.25V
= 5.25V
o
C to 70
HSP50215
CC
o
o
CC
CC
C
C
or GND, V
or GND, V
IN
IN
TEST CONDITIONS
o
C, Commercial; T
CC
= V
= V
CC
CC
Open, All Measurements Are
CC
CC
= 4.75V
= 4.75V
Thermal Information
Thermal Resistance (Typical, Note 2)
Maximum Package Power Dissipation at 70
Maximum Package Power Dissipation at 85
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
CC
CC
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.22W
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.81W
(MQFP - Lead Tips Only)
or GND,
or GND,
= 5.25V
= 5.25V
CCOP
is 2mA/MHz.
A
= -40
o
C to 85
o
C Industrial
MIN
2.0
3.0
2.6
-10
-10
-
-
-
-
-
-
-
-
MAX
+10
+10
500
156
144
0.8
0.8
0.4
o
o
10
12
C
C
-
-
-
(Note 3)
(Note 3)
(Note 4)
(Note 4)
o
UNITS
C to 150
mA
mA
JA
pF
pF
V
V
V
V
V
V
A
A
A
(
36
o
C/W)
o
o
o
C
C
C