HEF4011BP,652 NXP Semiconductors, HEF4011BP,652 Datasheet - Page 2
![IC GATE NAND QUAD 2INPUT 14DIP](/photos/6/57/65747/568-14-dip_sot27-1_sml.jpg)
HEF4011BP,652
Manufacturer Part Number
HEF4011BP,652
Description
IC GATE NAND QUAD 2INPUT 14DIP
Manufacturer
NXP Semiconductors
Series
4000Br
Datasheet
1.HEF4046BT652.pdf
(26 pages)
Specifications of HEF4011BP,652
Number Of Circuits
4
Package / Case
14-DIP (0.300", 7.62mm)
Logic Type
NAND Gate
Number Of Inputs
2
Current - Output High, Low
2.4mA, 2.4mA
Voltage - Supply
1.65 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Product
NAND
Logic Family
HE4000B
High Level Output Current
- 3.6 mA
Low Level Output Current
3.6 mA
Propagation Delay Time
45 ns
Supply Voltage (max)
15 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Logical Function
NAND
Number Of Elements
4
Operating Supply Voltage (typ)
3.3/5/9/12V
Operating Temp Range
-40C to 85C
Package Type
PDIP
Number Of Outputs
1
Technology
CMOS
Mounting
Through Hole
Pin Count
14
Operating Temperature Classification
Industrial
Quiescent Current
4uA
Operating Supply Voltage (max)
15V
Operating Supply Voltage (min)
3V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1683-5
933277590652
HEF4011BPN
933277590652
HEF4011BPN
Philips Semiconductors
INDEX
Note
1. Corrected 26 June 1997.
January 1995
SO
SOT108-1
SOT109-1
SOT162-1
SOT163-1
SOT137-1
SOT136-1
SSOP
SOT337-1
SOT338-1
SOT339-1
SOT340-1
SOT341-1
DIP
SOT27-1
SOT38-1
SOT102-1
SOT146-1
SOT101-1
SOT117-1
SOT129-1
CDIP
SOT73-1
SOT74-1
SOT133-1
SOT152-2
SOT94-1
SOT135-1
Package information
PACKAGE VERSIONS
(1)
plastic small outline package; 14 leads; body width 3.9 mm
plastic small outline package; 16 leads; body width 3.9 mm
plastic small outline package; 16 leads; body width 7.5 mm
plastic small outline package; 20 leads; body width 7.5 mm
plastic small outline package; 24 leads; body width 7.5 mm
plastic small outline package; 28 leads; body width 7.5 mm
plastic shrink small outline package; 14 leads; body width 5.3 mm
plastic shrink small outline package; 16 leads; body width 5.3 mm
plastic shrink small outline package; 20 leads; body width 5.3 mm
plastic shrink small outline package; 24 leads; body width 5.3 mm
plastic shrink small outline package; 28 leads; body width 5.3 mm
plastic dual in-line package; 14 leads (300 mil)
plastic dual in-line package; 16 leads (300 mil); long body
plastic dual in-line package; 18 leads (300 mil)
plastic dual in-line package; 20 leads (300 mil)
plastic dual in-line package; 24 leads (600 mil)
plastic dual in-line package; 28 leads (600 mil)
plastic dual in-line package; 40 leads (600 mil)
ceramic dual in-line package; 14 leads; glass seal
ceramic dual in-line package; 16 leads; glass seal
ceramic dual in-line package; 18 leads; glass seal
ceramic dual in-line package; 20 leads; glass seal
ceramic dual in-line package; 24 leads; glass seal
ceramic dual in-line package; 28 leads; glass seal
2
DESCRIPTION
Package outlines
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