74HCT1G04GV,125 NXP Semiconductors, 74HCT1G04GV,125 Datasheet
74HCT1G04GV,125
Specifications of 74HCT1G04GV,125
74HCT1G04GV
935271885125
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74HCT1G04GV,125 Summary of contents
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Inverter Rev. 04 — 16 July 2007 1. General description 74HC1G04 and 74HCT1G04 are high-speed Si-gate CMOS devices. They provide an inverting buffer. The HC device has CMOS input switching levels and supply voltage range ...
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... NXP Semiconductors 5. Functional diagram mna108 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin n. GND Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Input 74HC_HCT1G04_4 Product data sheet 74HC1G04 ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK I output clamping current OK I output current O I supply current CC I ground current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter For type 74HC1G04 V HIGH-level input IH voltage V LOW-level input IL voltage V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I supply current ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter I supply current CC I additional supply CC current C input capacitance I 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 6.0 ns; All typical values are measured Symbol Parameter ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Fig 5. The input (A) to output (Y) propagation delays Table 9. Measurement points Type 74HC1G04 74HCT1G04 Test data is given in Table 8. Definitions for test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance L Fig 6 ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74HC_HCT1G04_4 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... Release date 74HC_HCT1G04_4 20070716 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 2 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Abbreviations ...