mt18jsf25672ay-1g1 Micron Semiconductor Products, mt18jsf25672ay-1g1 Datasheet
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mt18jsf25672ay-1g1
Manufacturer Part Number
mt18jsf25672ay-1g1
Description
2gb, 4gb X72, Ecc, Dr 240-pin Ddr3 Sdram Udimm
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT18JSF25672AY-1G1.pdf
(20 pages)
DDR3 SDRAM UDIMM
MT18JSF25672A – 2GB
MT18JSF51272A – 4GB
For component data sheets, refer to Micron’s Web site:
Features
• DDR3 functionality and operations supported as
• 240-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC3-10600, PC3-8500,
• 2GB (256 Meg x 72), 4GB (512 Meg x 72)
• V
• V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
• Dual rank
• On-board I
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Lead-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1:
PDF: 09005aef83014429/Source: 09005aef83014466
JSF18C256_512x72A.fm - Rev. C 5/08 EN
Speed
Grade
defined in the component data sheet
(UDIMM)
or PC3-6400
data, strobe, and mask signals
serial presence-detect (SPD) EEPROM
via the mode register set (MRS)
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
DD
DDSPD
= 1.5V ±0.075V
= +3.0V to +3.6V
Nomenclature
2
PC3-10600
PC3-10600
PC3-10600
Key Timing Parameters
Industry
PC3-8500
PC3-8500
PC3-6400
PC3-6400
C temperature sensor with integrated
Products and specifications discussed herein are subject to change by Micron without notice.
CL = 10
1333
1333
1333
–
–
–
–
CL = 9
1333
1333
–
–
–
–
–
2GB, 4GB (x72, ECC, DR) 240-Pin DDR3 SDRAM UDIMM
Data Rate (MT/s)
CL = 8
1333
1066
1066
1066
1066
–
–
www.micron.com
1
CL = 7
1066
1066
1066
Figure 1:
Notes: 1. Contact Micron for industrial temperature
Options
• Operating temperature
• Package
• Frequency/CAS latency
–
–
–
–
PCB height: 30.0mm (1.181in)
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM (lead-free)
– 1.5ns @ CL = 8 (DDR3-1333)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.5ns @ CL = 10 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
– 1.87ns @ CL = 8 (DDR3-1066)
– 2.5ns @ CL = 5 (DDR3-800)
– 2.5ns @ CL = 6 (DDR3-800)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Not recommended for new designs.
CL = 6
800
800
800
800
800
800
800
module offerings.
240-Pin UDIMM (MO-269 R/C E)
CL = 5
800
800
–
–
–
–
–
A
A
1
≤ +85°C)
≤ +70°C)
13.125
t
(ns)
12.5
13.5
RCD
©2008 Micron Technology, Inc. All rights reserved.
12
15
15
15
2
2
2
2
13.125
(ns)
13.5
12.5
t
12
15
15
15
RP
Marking
Features
None
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Y
I
50.625
(ns)
49.5
52.5
52.5
t
48
51
50
RC