mt18ksf25672pdy-1g1 Micron Semiconductor Products, mt18ksf25672pdy-1g1 Datasheet - Page 8

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mt18ksf25672pdy-1g1

Manufacturer Part Number
mt18ksf25672pdy-1g1
Description
2gb Ddr3 Sdram Rdimm Mt18ksf25672pdy-1g1
Manufacturer
Micron Semiconductor Products
Datasheet
Temperature Sensor with Serial Presence-Detect EEPROM
Thermal Sensor Operations
Serial Presence-Detect EEPROM Operation
PDF: 09005aef833b06c2/Source: 09005aef833b0609
KSF18C256x72PD.fm - Rev. A 4/08 EN
The temperature from the integrated thermal sensor is monitored and converts into a
digital word via the I
to create a custom temperature-sensing solution based on system requirements.
Programming and configuration details comply with JEDEC Standard No. 21-C, page
4.7-1, “Mobile Platform Memory Module Thermal Sensor Component Specification.”
1.35V DDR3 SDRAM modules incorporate serial presence-detect. The SPD data is stored
in a 256-byte EEPROM. The first 128 bytes are programmed by Micron to comply with
JEDEC Standard JC-45 “Appendix X: Serial Presence Detect (SPD) for DDR3 SDRAM
Modules.” These bytes identify module-specific timing parameters, configuration infor-
mation, and physical attributes. User-specific information can be written into the
remaining 128 bytes of storage. System READ/WRITE operations between the master
(system logic) and the slave EEPROM device occur via a standard I
DIMM’s SCL (clock) and SDA (data) signals, together with SA[2:0], which provide eight
unique DIMM/EEPROM addresses. Write protect (WP) is connected to V
disabling hardware write protect.
2GB (x72, ECC, DR,1.35V) 240-Pin DDR3 SDRAM RDIMM
2
C bus. System designers can use the user-programmable registers
8
Micron Technology, Inc., reserves the right to change products or specifications without notice.
General Description
©2008 Micron Technology, Inc. All rights reserved
2
C bus using the
SS
, permanently
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