hys64t256022hdl-5-a Infineon Technologies Corporation, hys64t256022hdl-5-a Datasheet - Page 5

• Manufacturer Part Number: hys64t256022hdl-5-a
• Description: 200-pin So-dimm Ddr2 Sdram Modules
• Manufacturer: Infineon Technologies Corporation

1
This chapter gives an overview of the 200-Pin Small-Outline-DDR2-SDRAM Modules product family and
describes its main characteristics.
1.1
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Table 1
Product Type Speed Code
Speed Grade
Max. Clock Frequency
Min. RAS-CAS-Delay
Min. Row Precharge Time
Min. Row Active Time
Min. Row Cycle Time
1.2
The INFINEON HYS64T256022HDL–[3.7/5]–A module
family are low profile SO-DIMM modules with 30,0 mm
height based on DDR2 technology. DIMMs are
available as non-ECC modules in 256M
organisation and density, intended for mounting into
200-pin connector sockets.The memory array is
designed with stacked 1 Gb Double Data Rate (DDR2)
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic
Data Sheet
200-pin PC2-4200 and PC2-3200 DDR2 SDRAM
memory modules for use as main memory when
installed in systems such as mobile personal
computers.
256M
organisation
Standard Double-Data-Rate-Two Synchronous
DRAMs (DDR2 SDRAM) with a single + 1.8 V
(± 0.1 V) power supply
Built with stacked 1 Gb DDR2 SDRAMs in
P-TFBGA-71 chipsize packages
equipment as defined in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January
2003. These substances include mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls and
polybrominated biphenyl ethers.
64 module organisation, 2 128M
Overview
Features
Performance for DDR2-533 and DDR2-400
Description
@CL5
@CL4
@CL3
64 (2 GB)
f
f
f
t
t
t
t
CK5
CK4
CK3
RCD
RP
RAS
RC
8 chip
–3.7
PC2–4200 4–4–4
266
266
200
15
15
45
60
5
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Synchronous DRAMs for Non-ECC applications.
Decoupling capacitors are mounted on the PCB board.
The DIMMs feature serial presence detect based on a
serial E
first 128 bytes are programmed with configuration data
and the second 128 bytes are available to the
customer.
Programmable CAS Latencies (3, 4 and 5), Burst
Length (8 & 4) and Burst Type
Burst Refresh, Distributed Refresh and Self Refresh
All inputs and outputs SSTL_18 compatible
OCD (Off-Chip Driver Impedance Adjustment) and
ODT (On-Die Termination)
Serial Presence Detect with E
SO-DIMM Dimensions (nominal) :
30 mm high, 67.6 mm wide
Standard reference layouts Raw Card “D”
RoHS compliant products
Small Outline DDR2 SDRAM Modules
2
PROM device using the 2-pin I
HYS64T256022HDL–[3.7/5]–A
–5
PC2–3200 3–3–3
200
200
200
15
15
40
55
1)
09092004-D30U-XRMR
2
PROM
OverviewFeatures
Rev. 1.2, 2005-08
2
C protocol. The
MHz
MHz
MHz
Units
—
ns
ns
ns
ns