hys64t256022hdl-5-a Infineon Technologies Corporation, hys64t256022hdl-5-a Datasheet - Page 6

• Manufacturer Part Number: hys64t256022hdl-5-a
• Description: 200-pin So-dimm Ddr2 Sdram Modules
• Manufacturer: Infineon Technologies Corporation

Table 2
Product Type
PC2–3200
HYS64T256022HDL–5–A
PC2–4200
HYS64T256022HDL–3.7–A
Notes
1. All part numbers end with a place code, designating the silicon die revision. Example: HYS64T256022HDL–
2. The Compliance Code is printed on the module label and describes the speed grade, f.e. “PC2–4200S–444–
Table 3
DIMM
Density
2 GB
Table 4
Part Number
HYS64T256022HDL
1) For a detailed description of all functionalities of the DRAM components on these modules see the referenced component
2) Green Product
Data Sheet
5–A, indicating Rev. “A” dies are used for DDR2 SDRAM components. For all INFINEON DDR2 module and
component nomenclature see section 8 of this datasheet.
11–D”, where 4200S means Small Outline DIMM modules with 4.26 GB/sec Module Bandwidth and “444–11”
means CAS latency = 4,
produced on the Raw Card “D”.
datasheet.
Module
Organization
256M 64
Ordering Information for RoHS compliant products
Address Format
Components on Modules
t
RCD
DRAM components
reference datasheet
HYB18T2G802AF
Compliance Code
2GB 2R 8 PC2–3200S–333–11–D0
2GB 2R 8 PC2–4200S–444–11–D0
Memory
Ranks
2
latency = 4 and
1)2)
ECC/
Non-ECC
Non-ECC
t
RP
latency = 4 using the latest JEDEC SPD Revision 1.1 and
6
# of
SDRAMs
8
DRAM Density
2 1 Gbit
Small Outline DDR2 SDRAM Modules
Description
2 Ranks, Non-ECC 1 Gbit ( 8)
2 Ranks, Non-ECC 1 Gbit ( 8)
# of row/bank/columns bits
14/3/10
HYS64T256022HDL–[3.7/5]–A
DRAM Organisation
2 256M 8
09092004-D30U-XRMR
OverviewDescription
SDRAM
Technology
Rev. 1.2, 2005-08
Raw
Card
D