l4913adies STMicroelectronics, l4913adies Datasheet - Page 13

no-image

l4913adies

Manufacturer Part Number
l4913adies
Description
Rad-hard Positive Fixed Voltage Regulators
Manufacturer
STMicroelectronics
Datasheet
8.1
Die bonding pad locations and electrical functions
Die physical dimensions:
Pad size: V
Interface materials:
Glassivation:
Substrate: bare silicon
Assembly related information:
Die size: 150 mils x 110 mils (3.81 mm by 2.79 mm)
Die thickness: 375 µm ± 25 µm (14.8 mils ± 1 mil)
Control pads: 184 µm x 184 µm (7.25 mils square)
Top metallization: Al/Si/Cu, 1.05 µm ± 0.15 µm
Backside metallization: none
Type: p. vapox + nitride
Thickness: 0.6 µm ± 0.1 µm + 0.6 µm ± 0.08 µm
Substrate potential: floating recommended to be tied to ground
Special assembly instructions: "Sense" pad not used; not internally connected to
any part of the IC. Can be connected to ground when space anti-static electricity
rules apply.
IN
, V
OUT
pads: 450 µm x 330 µm (17.7 mils by 13 mils)
13/19

Related parts for l4913adies