upa2450c Renesas Electronics Corporation., upa2450c Datasheet

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upa2450c

Manufacturer Part Number
upa2450c
Description
Mos Field Effect Transistor
Manufacturer
Renesas Electronics Corporation.
Datasheet

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Part Number
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Quantity
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Part Number:
upa2450cTL-E1-A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Document No. G18792EJ1V0DS00 (1st edition)
Date Published June 2007 NS
Printed in Japan
DESCRIPTION
switching characteristics, and is suitable for applications such as
power switch of portable machine and so on.
FEATURES
ABSOLUTE MAXIMUM RATINGS (T
ORDERING INFORMATION
Note Pb-free (This product does not contain Pb in the external electrode and other parts.)
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.
• 2.5 V drive available
• Low on-state resistance
• Built-in G-S protection diode against ESD
by a 2.5 V power source.
The
The
Drain to Source Voltage (V
Gate to Source Voltage (V
Drain Current (DC)
Drain Current (pulse)
Total Power Dissipation (2 units)
Total Power Dissipation (2 units)
Channel Temperature
Storage Temperature
Notes 1. Mounted on ceramic board of 50 cm
μ
μ
R
R
R
R
PA2450CTL-E1-A
PA2450CTL-E2-A
DS(on)1
DS(on)2
DS(on)3
DS(on)4
PART NUMBER
μ
μ
PA2450C is a switching device, which can be driven directly
PA2450C features a low on-state resistance and excellent
2. PW ≤ 10
3. Mounted on FR-4 board of 50 cm
When this device actually used, an additional protection circuit is externally required if a voltage exceeding
the rated voltage may be applied to this device.
= 17.5 mΩ MAX. (V
= 18.5 mΩ MAX. (V
= 22.0 mΩ MAX. (V
= 27.5 mΩ MAX. (V
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Note
Note
Note1
μ
N-CHANNEL MOS FIELD EFFECT TRANSISTOR
s, Duty Cycle ≤ 1%
Note2
DS
LEAD PLATING
GS
GS
GS
GS
GS
= 0 V)
= 0 V)
= 4.5 V, I
= 4.0 V, I
= 3.1 V, I
= 2.5 V, I
Sn-Bi
Note1
Note3
D
D
D
D
V
V
I
I
P
P
T
T
A
D(DC)
D(pulse)
= 4.0 A)
= 4.0 A)
= 4.0 A)
= 4.0 A)
DSS
GSS
T1
T2
ch
stg
= 25°C)
FOR SWITCHING
2
DATA SHEET
x 1.1 mmt
2
x 1.1 mmt
3000 p/reel
PACKING
Reel
−55 to +150
±12.0
±70.0
MOS FIELD EFFECT TRANSISTOR
20.0
±8.6
150
2.5
0.7
6PIN HWSON (4521)
°C
°C
W
W
V
V
A
A
PACKAGE
(0.5)
1
2
3
PACKAGE DRAWING (Unit: mm)
μ
Gate1
(0.15)
Gate
Protection
Diode
Each lead has same dimensions.
1,2:
3:
7:
Source 1
Gate 1
Drain
PA2450C
EQUIVALENT CIRCUIT
7
Source1
4.4±0.1
5.0±0.1
Drain1
(2.2)
(0.9)
5,6:
4:
Body
Diode
Source 2
Gate 2
Gate2
Gate
Protection
Diode
6
5
4
Source2
Drain2
Body
Diode
2007

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upa2450c Summary of contents

Page 1

N-CHANNEL MOS FIELD EFFECT TRANSISTOR DESCRIPTION μ The PA2450C is a switching device, which can be driven directly by a 2.5 V power source. μ The PA2450C features a low on-state resistance and excellent switching characteristics, and is suitable for ...

Page 2

ELECTRICAL CHARACTERISTICS (T CHARACTERISTICS Zero Gate Voltage Drain Current Gate Leakage Current Gate to Source Cut-off Voltage Note Forward Transfer Admittance Note Drain to Source On-state Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off ...

Page 3

ELECTRICAL CHARACTERISTICS (T DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 120 100 100 125 - Ambient Temperature - ° FORWARD BIAS SAFE OPERATING AREA 1000 I 100 D(pulse) ...

Page 4

DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE 4 4 0.2 0.4 0 Drain to Source Voltage - V DS GATE TO SOURE CUT-OFF ...

Page 5

DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 4 Pulsed 2 3.1 V 4 100 T - Channel Temperature - ° ...

Page 6

When you use this device, in order to prevent a customer’s hazard and damage, use it with understanding the following contents. If used exceeding recommended conditions, there is a possibility of causing failure of ...

Page 7

This device is very thin device and should be handled with caution for mechanical stress. The rate of distortion applied to the device should become below 2000 of a device may be degraded and it may result in failure. ...

Page 8

The information in this document is current as of June, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most ...

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