cx28331 Mindspeed Technologies, cx28331 Datasheet - Page 54

• Manufacturer Part Number: cx28331
• Description: Single/dual/triple E3/ds3/sts-1line Interface Unit
• Manufacturer: Mindspeed Technologies

Appendix B: Exposed Thin Quad Flat (ETQFP) Pack
B.2 Package Thermal Characterization
Table B-1. Dimensional Parameters (mm)
B-4
NOTE(S):
(1)
100-lead ETQFP
Package Type
48-lead ETQFP
80-lead ETQFP
N represents the total number of thermal vias to be placed evenly across the entire PCB center pad. In the case of the 48-lead
ETQFP, all thermal vias are located within the exposed region of the center pad.
14.40
14.40
5.40
A
An array of 0.33 mm diameter thermal vias plated with 1 oz. copper must be
placed on the pad and shorted to the PCB’s ground plane. If the plating thickness
in the exposed region of the center pad is not sufficient to effectively plug the
barrel of the via when plated, use solder mask to cap the vias; the mask diameter
should have a dimension equal to the via diameter + 0.1 mm minimum. This
prevents the solder from wicking through the thermal via, potentially creating a
solder void in the region between the package bottom and the center pad on the
surface of the PCB.
family.
14.40
Mindspeed Proprietary and Confidential
14.40
5.40
B
Mindspeed Technologies
0.50
0.65
0.50
Table B-1
C
Single/Dual/Triple E3/DS3/STS-1 Line Interface Unit
lists the dimensions for the entire ETQFP package
0.25
0.35
0.25
D
™
CX28331/CX28332/CX28333 (-1x)
1.00
1.00
1.00
E
4.70 sq.
6.50 sq.
8.00 sq.
F
28333-DSH-001-A
7 x 7; 49
7 x 7; 49
3 x 3; 9
N
(1)