TSSOP-14 DIODES [Diodes Incorporated], TSSOP-14 Datasheet - Page 10

• Manufacturer Part Number: TSSOP-14
• Description: SUGGESTED PAD LAYOUT
• Manufacturer: DIODES [Diodes Incorporated]

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
Z
Dimensions Value (in mm)
Y
G
X1
X2
G
X
Y
C
Z
X2
X1
SOT143
Dimensions
X
Y (3x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
C
Z
X
Y
E
2.70
1.30
2.50
0.60
0.70
1.0
2.0
X (3x)
X2
C
C
Z
SOT523
0.51
SOT523 / SOT323 / SOT23 / SC59
1.8
0.4
1.3
0.7
Y
Y1
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SOT23F
X
SOT323
10 of 14
2.8
0.7
0.9
1.9
1.0
E
Dimensions Value (in mm)
SOT23
1.35
2.9
0.8
0.9
2.0
Y1
C
X
Y
C
Dimensions
Y2
Y1
C1
C2
X1
X2
Y1
Y2
X2
SC59
1.35
3.4
0.8
1.0
2.4
0.95
0.60
0.80
1.80
SOT223
X1
Value (in mm)
C2
3.3
1.2
1.6
1.6
6.4
2.3
C1
Suggested Pad Layout
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