TSSOP-14 DIODES [Diodes Incorporated], TSSOP-14 Datasheet - Page 6

• Manufacturer Part Number: TSSOP-14
• Description: SUGGESTED PAD LAYOUT
• Manufacturer: DIODES [Diodes Incorporated]

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
Y
X
X1
X
X2
Y
C
Y2
Z
C
G
Y3
W-DFN5020-6
U-DFN3030-10
X1
G
G
Y4
Dimensions Value (in mm)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
G
X1
X2
Y2
Y3
C
G
X
Y
Dimensions Value (in mm)
C
X1
X1
G
C
Z
X
Y
C
0.50
0.35
0.35
0.90
1.80
0.70
1.60
3.20
X (3x)
Y3
Y2
Y (2x)
2.60
0.15
1.80
0.60
0.30
0.50
Y1
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DFN322
Y1
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X
Dimensions
Y
Z
C
X1
Y1
Y2
Y3
Y4
G
C
X
Y
Z
C
W-DFN5060-4
X (4x)
(in mm)
Value
0.65
0.20
0.35
1.52
0.55
0.98
0.47
0.63
2.20
U-DFN3030-12
Y (4x)
X1
G
G
Dimensions Value (in mm)
Dimensions Value (in mm)
X1
G
Y1
Z
X
Y
C
C
X
Y
Z
Suggested Pad Layout
© Diodes Incorporated
2.60
0.15
1.80
0.60
0.28
0.45
4.00
0.75
0.95
6.20
4.75