TSSOP-14 DIODES [Diodes Incorporated], TSSOP-14 Datasheet - Page 5

• Manufacturer Part Number: TSSOP-14
• Description: SUGGESTED PAD LAYOUT
• Manufacturer: DIODES [Diodes Incorporated]

Y1
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
Y3 (2x)
Y2
G7
G4
X3
G5
X1
X (4x)
G6
C
G1
R
G2
X2
G3
G8
(x8)
G
U-DFN3030-4
Y
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
X (x8)
C
Dimensions
Y2
C1
G1
G2
G3
G4
G5
G6
G7
G8
G1
X1
X2
X3
Y1
Y2
Y3
C
R
X
Y
C
X
X1
Value (in mm)
Y1
1.300
0.100
0.150
0.830
0.115
0.135
0.170
0.500
0.500
0.150
0.500
1.375
1.225
1.175
1.980
1.015
0.715
0.650
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W-DFN3020-8
U-DFN3030-8
Y2
Y1
Y
Type B
Type E
5 of 14
X2
Dimensions
Dimensions Value (in mm)
Y
C1
Y1
Y2
C
X
Y
G1
X1
Y1
Y2
C
G
X
Y
Z
C
Value (in mm)
0.650
0.285
0.090
0.400
1.120
0.730
0.500
0.365
0.65
2.35
0.30
0.65
1.60
2.75
U-DFN3030-8
X1
G
Dimensions Value (in mm)
X1
X2
G
C
Z
Y
Suggested Pad Layout
© Diodes Incorporated
2.59
0.11
2.49
0.65
0.39
0.65