TSSOP-14 DIODES [Diodes Incorporated], TSSOP-14 Datasheet - Page 11

• Manufacturer Part Number: TSSOP-14
• Description: SUGGESTED PAD LAYOUT
• Manufacturer: DIODES [Diodes Incorporated]

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
Dimensions
C1
C2
G
Z
X
Y
SC74R / SOT26 / SOT363 / SOT563
SC74R / SOT26
Z
G
Y
3.20
1.60
0.55
0.80
2.40
0.95
X
G
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
C2
Y (5X)
(6x)
X
X (5X)
C
C2
SOT363
0.42
0.65
2.5
1.3
0.6
1.9
C
C1
C
Y (6x)
SOT563
0.375
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2.2
1.2
0.5
1.7
0.5
SOT666
SOT953
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Dimensions Value (in mm)
Dimensions Value (in mm)
Dimensions
Y1
C
G
C
X
Y
X
Y
C1
C2
G
Z
X
Y
Z
SOT25 / SOT353 / SOT553
G
Y
0.350
0.200
0.200
1.100
0.50
0.80
0.35
0.50
SOT25
3.20
1.60
0.55
0.80
2.40
0.95
X
C2
SOT353
C2
0.42
0.65
2.5
1.3
0.6
1.9
Suggested Pad Layout
C1
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SOT553
0.375
2.2
1.2
0.5
1.7
0.5