JANHCA2N2484 STMICROELECTRONICS [STMicroelectronics], JANHCA2N2484 Datasheet
JANHCA2N2484
Related parts for JANHCA2N2484
JANHCA2N2484 Summary of contents
Page 1
The documentation and process conversion measures necessary to comply with this revision shall be completed by 31 November 2000. SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW-POWER TYPES 2N2484, 2N2484UA, 2N2484UB, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC This specification is approved ...
Page 2
Dimensions Symbol Inches Millimeters Min Max Min CD .178 .195 4.52 CH .170 .210 4.32 HD .209 .230 5.31 LC .100 TP 2. .016 .021 0.41 LL .500 .750 12 .016 .019 0.41 L1 --- .050 ...
Page 3
Symbol NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Dimension "A" controls the overall package thickness. When a ...
Page 4
Ltr NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Dimensions B2 and B3 are identical Dimension L2 is identical ...
Page 5
NOTES: 1. Die size...............................................0.015 x 0.019 inches 2. Die thickness.......................................0.010 3. Top metal............................................Aluminum 15,000Å minimum, 18,000Å nominal 4. Back metal..........................................A. Gold 2,500Å minimum, 3,000Å nominal 5. Backside .............................................Collector 6. Bonding pad........................................B = 0.003 inches 0.004 inches diameter 7. ...
Page 6
Die size:.....................................................0.018 x 0.018 inches Die thickness: ............................................0.008 Base pad: ..................................................0.0025 inches diameter Emitter pad: ...............................................0.003 inches diameter Back metal:................................................Gold, 6500 Top metal: .................................................Aluminum, 19500 Back side: ..................................................Collector Glassivation:..............................................SiO2, 7500 FIGURE 5. Physical dimensions, JANHC and JANKC die ...
Page 7
Primary electrical characteristics dc 100 Hz dB Min Max 7.5 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. ...
Page 8
REQUIREMENTS 3.1 General. The requirements for acquiring the product described herein shall consist of this document and MIL-PRF-19500. 3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity ...
Page 9
Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table IV of MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of ...
Page 10
Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as specified herein. If alternate screening is being performed in accordance with MIL-PRF-19500, a sample of screened devices shall be submitted to and pass the requirements of group ...
Page 11
Group B sample selection. Samples selected from group B inspection shall meet all of the following requirements: a. For JAN, JANTX, and JANTXV, samples shall be selected randomly from a minimum of three wafers (or from each wafer in ...
Page 12
Inspection 1/ Method Subgroup 1 2/ Visual and mechanical 2071 examination 3/ Solderability 3/ 4/ 2026 Resistance to solvents 1022 Temperature cycling 3/ 4/ 1051 Hermetic seal 4/ 1071 Fine leak Gross leak Electrical measurements 4/ Bond ...
Page 13
Inspection 1/ Method Subgroup 2 - continued. Forward-current transfer ratio 3076 Forward-current transfer ratio 3076 Forward-current transfer ratio 3076 Forward-current transfer ratio 3076 Forward-current transfer ratio 3076 Collector to emitter voltage 3071 (saturated) Base emitter voltage 3066 (nonsaturated) Subgroup 3 ...
Page 14
Inspection 1/ Method Subgroup 4 - continued. Small-signal short- circuit 3206 forward current transfer ratio Open circuit output 3236 capacitance Input capacitance (output 3240 open-circuited) Noise figure 3246 Noise figure 3246 Noise figure 3246 Noise figure (wideband) 3246 Subgroups 5 ...
Page 15
TABLE II. Group E inspection (all quality levels) - For qualification only. Inspection Method Subgroup 1 Temperature cycling 1051 (air to air) Hermetic seal 1071 Fine leak Gross leak Electrical measurements Subgroup 2 Intermittent life 1037 Electrical measurements Subgroup 3 ...
Page 16
TABLE III. Groups B and C delta measurements Step Inspection 1 Forward-current transfer ratio 2. Collector to emitter voltage (saturated) 3. Collector to emitter cutoff current 1/ The delta measurements for group B, table VIa (JANS) of ...
Page 17
... JANHCA1N645-1) will be identified on the QML. PIN 2N2484 6.5 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. MIL-PRF-19500/376E JANC ordering information Manufacturer 43611 JANHCA2N2484 JANHCB2N2484 JANKCA2N2484 JANKCB2N2484 17 34156 ...
Page 18
Custodians: Army - CR Navy - EC Air Force - 11 NASA - NA DLA - CC Review activities: Army - AR, MI, SM Navy - AS, CG, MC, SH Air Force - 13, 19 MIL-PRF-19500/376E 18 Preparing activity: DLA ...
Page 19
STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL 1. The preparing activity must complete blocks and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, ...