88e3015 Marvell Semiconductor, Inc., 88e3015 Datasheet - Page 89

• Manufacturer Part Number: 88e3015
• Description: Integrated 10/100 Fast Ethernet Transceiver
• Manufacturer: Marvell Semiconductor, Inc.

4.3 Package Thermal Information
4.3.1 88E3015 Device 56-Pin QFN package
Copyright © 2006 Marvell
October 26, 2006, Advance
Symbol
θ
ψ
θ
θ
JA
JC
JB
JT
1. Refer to white paper TJ Thermal Calculations for more information.
Parameter
Thermal resistance -
junction to ambient of the
56-Pin QFN package
θ
P = Total Power Dissipa-
tion
Thermal characteristic
parameter
top center of the 56-Pin
QFN package
ψ
P = Total Power Dissipa-
tion
Thermal resistance
junction to case for the
56-Pin QFN package
θ
PTop = Power Dissipa-
tion from the top of the
package
Thermal resistance
junction to board for the
56-Pin QFN package
θ
P
tion from the bottom of
the package to the PCB
surface.
JA
JC
JB
JT
bottom
= (T
= (T
= (T
= (T
= power dissipa-
J
J
J -
J
-T
- T
- T
1
T
- junction to
C
A)
C
B
)/P.
)/ PTop
)/ P
/ P
bottom
1
1
Document Classification: Proprietary Information
-
-
Condition
JEDEC 3 in. x 4.5 in. 4-layer
PCB with no air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with 1 meter/sec air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with 2 meter/sec air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with 3 meter/sec air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with no air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with 1 meter/sec air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with 2 meter/sec air flow
JEDEC 3 in. x 4.5 in. 4-layer
PCB with 3 meter/sec air flow
JEDEC with no air flow
JEDEC with no air flow
CONFIDENTIAL
Mi n
Package Thermal Information
Doc. No. MV-S103657-00, Rev. C
Typ
33.40
29.50
28.20
27.50
0.55
0.94
1.19
1.33
17.90
21.80
Max
Units
°C/W
°C/W
°C/W
C/W
°C/W
°C/W
°C/W
C/W
°C/W
°C/W
Page 89