nup4103 ON Semiconductor, nup4103 Datasheet
nup4103
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nup4103 Summary of contents
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... Pb−Free Package (Note: Microdot may be in either location) TOP VIEW BOTTOM VIEW (Bumps Down) (Bumps Up ORDERING INFORMATION Device Package Shipping Flip−Chip 3000/Tape & Reel Flip−Chip 3000/Tape & Reel (Pb−Free) Publication Order Number: NUP4103FC/D † ...
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ELECTRICAL CHARACTERISTICS Parameter Reverse Stand−Off Voltage Breakdown Voltage Leakage Current Junction Capacitance 1. TVS devices are normally selected according to the working peak reverse voltage (V or continuous peak operating voltage level measured at pulse test current ...
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V/div Figure 3. ESD Response for Human Body Model (+8 kV) 500 mV/div Figure 4. ESD Response for Human Body Model (−8 kV) http://onsemi.com 3 200 ns 200 ns ...
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Printed Circuit Board Recommendations Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width Copper NSMD Figure 5. Solder Mask versus Non−Solder Mask Definition ...
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... A SEATING PLANE American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. ...