nup4103 ON Semiconductor, nup4103 Datasheet

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nup4103

Manufacturer Part Number
nup4103
Description
Quad Tvs Array In 5 Bump Flip Chip Pkg
Manufacturer
ON Semiconductor
Datasheet
1.NUP4103.pdf (5 pages)

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Quantity
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NUP4103FC
Four Channel ESD Array
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
Features
•
•
•
•
•
Benefits
•
•
•
•
Applications
•
•
•
•
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 1
MAXIMUM RATINGS
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ESD Discharge IEC61000−4−2,
Human Body Model
Machine Model
Junction Temperature
Operating Ambient Temperature Range
Storage Temperature Range
This integrated transient voltage suppressor device (TVS) is
Count
HBM and MM
Unidirectional, Quad ESD Protection
Ultra−small Flip−Chip Packaging (0.95 mm x 1.33 mm)
Compliance with IEC61000−4−2 (Level 4) Requirements
Maximum Leakage Current of 100 nA at 3.3 V
Pb−Free Package is Available*
Protects Four Data Lines from ESD while Reducing Component
Small Package Saves on PCB Real Estate
Provides Protection for ESD Industry Standards, IEC 61000,
Low Leakage Capability Minimizes Power Loss in the System
ESD Protection for Portable Equipment
Cell Phones
MP3 Players
PDAs
− Air Discharge
− Contact Discharge
Rating
Symbol
T
V
T
T
STG
PP
A
J
−55 to +150
−40 to +85
Value
150
1.6
30
30
16
1
Unit
kV
°C
°C
°C
†For information on tape and reel specifications,
NUP4103FCT1
NUP4103FCT1G
5−PIN FLIP−CHIP CSP
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
(Note: Microdot may be in either location)
Device
A1
A3
CASE 766AB
C
A
B
(Bumps Down)
1
PLASTIC
TOP VIEW
E
M
G
ORDERING INFORMATION
1 2
CIRCUIT DESCRIPTION
http://onsemi.com
3
= Specific Device Code
= Date Code
= Pb−Free Package
(Pb−Free)
Flip−Chip
Flip−Chip
Package
B2
Publication Order Number:
A
B
C
È
È
BOTTOM VIEW
3000/Tape & Reel
3000/Tape & Reel
(Bumps Up)
MARKING
DIAGRAM
3
E M G
Shipping
NUP4103FC/D
G
2
1
C1
C3
†

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nup4103 Summary of contents

Page 1

... Pb−Free Package (Note: Microdot may be in either location) TOP VIEW BOTTOM VIEW (Bumps Down) (Bumps Up ORDERING INFORMATION Device Package Shipping Flip−Chip 3000/Tape & Reel Flip−Chip 3000/Tape & Reel (Pb−Free) Publication Order Number: NUP4103FC/D † ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter Reverse Stand−Off Voltage Breakdown Voltage Leakage Current Junction Capacitance 1. TVS devices are normally selected according to the working peak reverse voltage (V or continuous peak operating voltage level measured at pulse test current ...

Page 3

V/div Figure 3. ESD Response for Human Body Model (+8 kV) 500 mV/div Figure 4. ESD Response for Human Body Model (−8 kV) http://onsemi.com 3 200 ns 200 ns ...

Page 4

Printed Circuit Board Recommendations Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width Copper NSMD Figure 5. Solder Mask versus Non−Solder Mask Definition ...

Page 5

... A SEATING PLANE American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. ...

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