nup4103 ON Semiconductor, nup4103 Datasheet - Page 5

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nup4103

Manufacturer Part Number
nup4103
Description
Quad Tvs Array In 5 Bump Flip Chip Pkg
Manufacturer
ON Semiconductor
Datasheet

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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
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Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
TERMINAL A1
4 X
LOCATOR
0.05
0.03 C
0.10 C
5 X
0.10 C
0.05 C
C
b
A
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
B
1
2
3
È
A
D1
D
B
f
C
A2
e
A
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
A1
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
SEATING
PLANE
PACKAGE DIMENSIONS
A
E
B
5−PIN FLIP−CHIP CSP
http://onsemi.com
C
CASE 766AB−01
ISSUE O
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
ASME Y14.5M, 1994.
CROWNS OF SOLDER BALLS.
DIM
A1
A2
D1
A
D
E
b
e
f
0.210
0.380
0.290
MILLIMETERS
MIN
−−−
1.330 BSC
0.960 BSC
0.500 BSC
0.433 BSC
0.866 BSC
0.680
0.270
0.430
0.340
MAX
NUP4013FC/D

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