nup4103 ON Semiconductor, nup4103 Datasheet - Page 4

• Manufacturer Part Number: nup4103
• Description: Quad Tvs Array In 5 Bump Flip Chip Pkg
• Manufacturer: ON Semiconductor

Printed Circuit Board Recommendations
PCB Pad Size
Pad Shape
Pad Type
Solder Mask Opening
Solder Stencil Thickness
Stencil Aperture
Solder Flux Ratio
Solder Paste Type
Trace Finish
Trace Width
Figure 5. Solder Mask versus Non−Solder Mask Definition
250
200
150
100
50
0
Parameter
0
1 to 5 °C/s
Figure 6. Solder Reflow Profile
1
NSMD
140 to 160 °C
Copper
Controlled Atmosphere
1 to 2 min
http://onsemi.com
183 °C
235°C Max
TIME (minutes)
225°C Min
2
4
30−100 sec
Solder Mask
3
SMD
No Clean Type 3 or Finer
300 mm Solder Ball
2 to 5 °C/s
4
250 x 250 mm sq.
250 mm +25 / −0
500 mm Pitch
150 mm Max
350 mm ±25
OSP Cu
125 mm
Round
NSMD
50/50
5