ISL5217_05 INTERSIL [Intersil Corporation], ISL5217_05 Datasheet - Page 21

• Manufacturer Part Number: ISL5217_05
• Description: Quad Programmable Up Converter
• Manufacturer: INTERSIL [Intersil Corporation]

Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.8V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class I
Operating Conditions
Voltage Range Core, V
Voltage Range I/O, V
Temperature Range
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
DC Electrical Specifications
NOTES:
Logical One Input Voltage
Logical Zero Input Voltage
Clock Input High
Clock Input Low
Output High Voltage
Output Low Voltage
Input Leakage Current
Output Leakage Current
Input Pull-up Leakage Current Low
Input Pull-up Leakage Current High
Standby Power Supply Current
Operating Power Supply Current
Input Capacitance
Output Capacitance
1. θ
2. Single supply operation of both the core VCCC and I/O VCCIO at 2.5V is allowed. Degradation of the I/O timing should be expected.
3. Tie 196CABGA package rows F, G, H, and J pins 6-9 to heat sink or ground to ensure maximum device heat dissipation.
4. Power Supply current is proportional to operation frequency. Typical rating for I
5. Capacitance T
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
Brief TB379.
process or design changes.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
PARAMETER
A
CCCIO
= 25
CCC
o
C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
. . . . . . . . . . . . . . . . . . . . +2.4V to +2.6V
(Note 2) . . . . . . . . . . . +3.15V to +3.45V
21
V
CCC
SYMBOL
I
I
C
CCOP
V
CCSB
V
V
V
V
C
V
I
I
OUT
SH
IHC
I
SL
IHL
OH
I
OL
H
IH
L
IL
IN
= 2.5 ± 5%, V
V
V
V
V
I
I
V
V
V
TMS, TRST, TDI
V
TMS, TRST, TDI
V
f = 80MHz, V
V
Freq = 1MHz, V
Referenced to Device Ground
Freq = 1MHz, V
Referenced to Device Ground
OH
OL
CCC
CCC
CCC
CCC
IN
IN
IN
IN
CCC
CCIO
o
= 2mA, V
= V
= V
= V
= V
= -2mA, V
C to 85
CC
CCIO
= 2.6V, V
= 2.4V, V
= 2.6V, V
= 2.4V, V
= 2.6V, V
= 3.45V, V
CCIO
CCIO
CCIO
CCIO
+0.5V
CC
= 3.3 ±5%, T
o
C
IN
CCC
or GND, V
or GND, V
or GND, V
or GND, V
ISL5217
CCC
CCIO
CCIO
CCIO
CCIO
CCIO
= V
CCIO
CCIO
CCC
TEST CONDITIONS
= 2.4V, V
CCIO
= 2.4V, V
= 3.45V
= 3.15V
= 3.45V
= 3.15V
= 3.45V, Outputs Not Loaded
Open, All Measurements Are
Open, All Measurements are
= 2.6V
CCC
CCC
CCC
CCC
A
Thermal Information
Thermal Resistance (Typical, Notes 1, 3)
Maximum Package Power Dissipation at 85
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
or GND,
= -40
196 Lead BGA Package. . . . . . . . . . . . . . . . . . . . . .
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
196 Lead BGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . .1.97W
CCIO
CCIO
= 2.6V, V
= 2.6V, V
= 2.6V, V
= 2.6V, V
CCOP
o
C to 85
= 3.15V
= 3.15V
is 7mA/MHz.
CCIO
CCIO
CCIO
CCIO
o
C
= 3.45V
= 3.45V
= 3.45V,
= 3.45V,
-500
MIN
2.0
2.0
2.6
-10
-10
-
-
-
-
-
-
-
o
C
MAX
540
0.8
0.8
0.4
10
10
10
5
7
7
-
-
-
-
mA (Note 4)
pF (Note 5)
pF (Note 5)
o
θ
C to 150
UNITS
JA
July 8, 2005
mA
µA
µA
µA
µA
V
V
V
V
V
V
FN6004.3
(
33
29
27
o
C/W)
o
o
o
C
C
C