MPC8358 FREESCALE [Freescale Semiconductor, Inc], MPC8358 Datasheet - Page 66

• Manufacturer Part Number: MPC8358
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Package and Pin Listings
Figure 50
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8358E is available in
a plastic ball grid array (PBGA), see
Section 21.2, “Mechanical Dimensions of the PBGA
21.1
The package parameters for rev 2.0 silicon are as provided in the following list. The package type is 29
mm x 29 mm, 668 plastic ball grid array (PBGA).
66
MPC8358E PowerQUICC™ II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 1
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the PBGA Package
provide the AC test load for the USB.
Output
Section 21.1, “Package Parameters for the PBGA
Figure 50. USB AC Test Load
Z
0
= 50 Ω
29 mm x 29 mm
668
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
0.64 mm
Package,” for information on the package.
R
L
= 50 Ω
OV
DD
/2
Freescale Semiconductor
Package,” and