MPC8358 FREESCALE [Freescale Semiconductor, Inc], MPC8358 Datasheet - Page 85

• Manufacturer Part Number: MPC8358
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Example:
23 Thermal
This section describes the thermal specifications of the MPC8358E.
23.1
Table 75
Freescale Semiconductor
4. Insert the chosen SPMF, COREPLL, CEPMF and CEPDF to the RCWL fields respectively.
•
Junction-to-ambient Natural Convection on single layer board (1s)
Junction-to-ambient Natural Convection on four layer board (2s2p)
Junction-to-ambient (@1 m/s) on single layer board (1s)
Junction-to-ambient (@ 1 m/s) on four layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
MPC8358E PowerQUICC™ II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 1
Engine clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. “s10” and “c1” are
selected from
is “0.”
To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and QUICC
SPMF
1000
provides the package thermal characteristics for the 668 29 mm x 29 mm PBGA package.
Thermal Characteristics
0000011
CORE
PLL
Table 75. Package Thermal Characteristics for the PBGA Package
Table
CEPMF CEPDF
74. SPMF is “1000,” CORPLL is “0000011,” CEPMF is “01001,” and CEPDF
01001
Characteristic
0
Input Clock
(MHz)
33
CSB Freq
(MHz)
266
Symbol
R
R
R
R
R
R
θJMA
θJMA
Core Freq
θJC
θJA
θJA
θJB
(MHz)
400
Value
20
14
15
11
6
4
Freq (MHz)
Engine
QUICC
300
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
(MHz)
400
∞
Notes
1, 2, 3
1, 2
1, 3
1, 3
4
5
Thermal
85