MPC8533E_10 FREESCALE [Freescale Semiconductor, Inc], MPC8533E_10 Datasheet - Page 77

• Manufacturer Part Number: MPC8533E_10
• Description: Integrated Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

18.2
Figure 55
783 FC-PBGA package without a lid.
Freescale Semiconductor
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads.
7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise.
Mechanical Dimensions of the MPC8533E FC-PBGA
shows the mechanical dimensions and bottom surface nomenclature of the MPC8533E,
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature
of the MPC8533E FC-PBGA without a Lid
Package Description
77