MPC8533E_10 FREESCALE [Freescale Semiconductor, Inc], MPC8533E_10 Datasheet - Page 97

• Manufacturer Part Number: MPC8533E_10
• Description: Integrated Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure
interface pressure.
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
Freescale Semiconductor
57). Therefore, the synthetic grease offers the best thermal performance, especially at the low
Chomerics, Inc. 781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation800-248-2481
Corporate Center
P.O.Box 999
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company800-347-4572
18930 West 78
1.5
0.5
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
2
1
0
Figure 59. Thermal Performance of Select Thermal Interface Materials
0
th
St.
10
20
Contact Pressure (psi)
30
40
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
70
80
Thermal
97