MPC862 MOTOROLA [Motorola, Inc], MPC862 Datasheet - Page 9

• Manufacturer Part Number: MPC862
• Description: Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

4
Table 3 shows the thermal characteristics for the MPC862/857T/857DSL.
MOTOROLA
1
2
3
4
5
6
Junction to ambient
Junction to board
Junction to case
Junction to package top
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
is measured on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold
plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to case
thermal resistance is a simulated value from the junction to the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2.
Thermal Characteristics
Rating
5
4
1
Table 3. MPC862/857T/857DSL Thermal Resistance Data
6
MPC862/857T/857DSL Hardware Specifications
Freescale Semiconductor, Inc.
Natural Convection
Air flow (200 ft/min)
Natural Convection
Air flow (200 ft/min)
For More Information On This Product,
Go to: www.freescale.com
Environment
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Symbol
R
R
R
R
R
R
θ JMA
θ JMA
θ JMA
Ψ
Ψ
θ JA
θ JC
θ JB
JT
JT
Thermal Characteristics
2
3
3
3
Value
37
23
30
19
13
6
2
2
°C/W
Unit
9