MC68HC705T16 MOTOROLA [Motorola, Inc], MC68HC705T16 Datasheet - Page 123

• Manufacturer Part Number: MC68HC705T16
• Description: High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit
• Manufacturer: MOTOROLA [Motorola, Inc]

This section provides the mechanical dimension for the 56-pin SDIP package for the
MC68HC05T16.
15.1
MC68HC05T16
Seating
Plane
- T -
Dim.
A
B
C
D
E
G
F
56
1
51.69
13.72
Min.
3.94
0.36
0.81
MECHANICAL SPECIFICATIONS
1.778 BSC
56-pin SDIP Package
D
0.89 BSC
0.25 M T A S
52.45
14.22
Max.
5.08
0.56
1.17
F
Figure 15-1 56-pin SDIP Mechanical Dimensions
1. Dimensions and tolerancing per ANSI Y 14.5 1982.
2. All dimensions in mm.
3. Dimension L to centre of lead when formed parallel.
4. Dimensions A and B do not include mould flash. Allowable mould
Case No. 859-01
flash is 0.25 mm.
56 lead SDIP
MECHANICAL SPECIFICATIONS
- A -
E
G
15
Notes
P
28
29
N
- B -
C
K
J
0.25 M T B S
Dim.
M
H
K
N
P
J
L
H
L
Min.
0.20
2.92
0.51
1.78
0
15.24 BSC
7.62 BSC
MOTOROLA
Max.
0.38
3.43
1.02
2.29
15
M
TPG
15-1
15