LAN8187I SMSC [SMSC Corporation], LAN8187I Datasheet - Page 66

• Manufacturer Part Number: LAN8187I
• Description: High-Performance MII and RMII 10/100 Ethernet PHY with HP Auto-MDIX
• Manufacturer: SMSC [SMSC Corporation]

Chapter 7 Package Outline
Revision 0.6 (02-24-06)
ccc
A1
A2
E1
R2
L1
W
D1
D
H
R
A
E
L
e
θ
Figure 7.1 64 Pin TQFP Package Outline, 10X10X1.4 Body, 12x12 mm Footprint
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
11.80
11.80
0.05
1.35
9.80
9.80
0.09
0.45
0.17
0.08
0.08
MIN
0
~
~
~
Maximum mold protrusion is 0.25 mm per side.
o
0.50 Basic
NOMINAL
Table 7.1 64 Pin TQFP Package Parameters
0.60
1.00
0.22
~
~
~
~
~
~
~
~
~
~
~
~
12.20
10.20
12.20
10.20
MAX
1.60
0.15
1.45
0.20
0.75
0.27
0.20
0.08
DATASHEET
7
~
~
High-Performance MII and RMII 10/100 Ethernet PHY with HP Auto-MDIX
o
66
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Length
Lead Foot Radius
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Coplanarity
Lead Pitch
Standoff
X Span
Y Span
SMSC LAN8187/LAN8187I
Datasheet