25LC512-1/MF MICROCHIP [Microchip Technology], 25LC512-1/MF Datasheet - Page 21

• Manufacturer Part Number: 25LC512-1/MF
• Description: 512 Kbit SPI Bus Serial EEPROM
• Manufacturer: MICROCHIP [Microchip Technology]

© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
E
A
NOTE 2
Preliminary
EXPOSED PAD
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
0.80
0.00
MIN
3.90
2.20
0.35
0.50
0.20
K
25AA512/25LC512
b
MILLIMETERS
1.27 BSC
0.20 REF
5.00 BSC
6.00 BSC
BOTTOM VIEW
NOM
0.85
0.01
4.00
2.30
0.40
0.60
8
–
Microchip Technology Drawing C04-122B
D2
e
2
1
N
MAX
1.00
0.05
0.75
4.10
2.40
0.48
–
L
NOTE 1
DS22021B-page 21
E2