IS42S83200B ISSI [Integrated Silicon Solution, Inc], IS42S83200B Datasheet - Page 62

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IS42S83200B

Manufacturer Part Number
IS42S83200B
Description
32Meg x 8, 16Meg x16 256-MBIT SYNCHRONOUS DRAM
Manufacturer
ISSI [Integrated Silicon Solution, Inc]
Datasheet

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PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. C
01/28/02
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
C
D
A
b
E
e
L
e
Plastic TSOP (T - Type II)
Min
22.02 22.42
10.03 10.29
11.56 11.96
0.71 REF
Millimeters
0.05
0.30
0.12
0.80 BSC
0.40
Max
1.20
0.45
0.21
0.60
0.15
54
D
Min
0.002 0.006
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
Inches
Max
0.047
N/2+1
b
N/2
E1
A
A1
No. Leads (N)
Ref. Std.
Symbol
E
A1
A2
E1
L1
ZD
C
D
A
E
b
e
L
SEATING PLANE
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.16 BSC
11.56 11.96
0.05
0.95
0.17
0.12
0.40
0.80 REF
0.50 BSC
0.61 REF
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
Max
1.20
0.15
1.05
0.27
0.21
0.60
86
.
ISSI
Min
0.867 0.8827
0.400 BSC
0.455 0.471
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.020 BSC
0.016 0.024
0.031 REF
Inches
0.024 BSC
Max
0.047
should be
C
®
1

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