HYB18H256321BF QIMONDA [Qimonda AG], HYB18H256321BF Datasheet - Page 37
HYB18H256321BF
Manufacturer Part Number
HYB18H256321BF
Description
256-Mbit GDDR3 Graphics RAM GDDR3 Graphics RAM
Manufacturer
QIMONDA [Qimonda AG]
Datasheet
1.HYB18H256321BF.pdf
(41 pages)
- Current page: 37 of 41
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5.2
Notes
1. Theta_jA: Junction to Ambient thermal resistance. The values have been obtained by simulation using the conditions stated
2. Theta_jB: Junction to Board thermal resistance. The value has been obtained by simulation.
3. Theta_jC: Junction to Case thermal resistance. The value has been obtained by simulation.
Rev. 0.80, 2007-09
09132007-07EM-7OYI
JEDEC Board
Air Flow
K/W
in the JEDEC JESD-51 standard.
Package Thermal Characteristics
1s0p
0 m/s
40
1 m/s
32
3 m/s
27
Theta_jA
2s0p
0 m/s
22
37
PG-TFBGA-136 Package Thermal Resistances
1 m/s
19
3 m/s
17
Theta_jB
-
5
Internet Data Sheet
HYB18H256321BF
256-Mbit GDDR3
TABLE 20
Theta_jC
-
2
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