HT6256DB HONEYWELL [Honeywell Solid State Electronics Center], HT6256DB Datasheet - Page 8

• Manufacturer Part Number: HT6256DB
• Description: HIGH TEMPERATURE 32K x 8 STATIC RAM
• Manufacturer: HONEYWELL [Honeywell Solid State Electronics Center]

HT6256
QUALITY ASSURANCE
Honeywell maintains a high level of product integrity through
process control utilizing statistical process control, a com-
plete “Total Quality Assurance System,” and a computer
data base process performance tracking system. This
Total Quality approach ensures our customers of a reliable
product by engineering in reliability, starting with process
development and continuing through product qualification
and screening.
SCREENING LEVELS
Honeywell offers several levels of device screening to
meet your system needs. Hi-Rel Level B devices undergo
additional screening per the requirements of MIL-STD-883.
RELIABILITY
Honeywell understands the stringent reliability require-
ments for extreme environment systems and has exten-
sive experience in reliability testing on programs of this
ORDERING INFORMATION (1)
(1) Orders may be faxed to 612-954-2257. Please contact our Customer Service Department at 612-954-2888 for further information.
28-LEAD DIP PACKAGE
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any liability
arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
900202 Rev. B
4-98
Ceramic
A
L
Body
Z
D - Indicates package type
For packaging options, call Honeywell
To learn more about Honeywell Solid State Electronics Center,
Q
Y
1
D = 28-Lead DIP
visit our web site at http://www.ssec.honeywell.com
b2
X
Reading
(width)
on Lid
Right
D
b
(pitch)
e
Capacitors
Optional
HT6256DC
S2
E
S1
8
nature. Reliability attributes of the HTMOS process were
characterized by testing test structures from which specific
failure mechanisms were evaluated. These specific mecha-
nisms included, but were not limited to, hot carriers, electromi-
gration and time dependent dielectric breakdown. This data
was then used to make changes to the design models and
process to ensure reliable -55 to +225 C specified products.
PACKAGING
The standard package is a hermetic 28-lead DIP con-
structed of multilayer ceramic (Al
power and ground planes. Ceramic chip capacitors can be
mounted to the package by the user to maximize supply
noise decoupling and increase board packing density.
These capacitors connect to the internal package power
and ground planes. This design minimizes resistance and
inductance of the bond wire and package. For packaging
options with surface mount capability or external control of
Chip Enable (CE), call Honeywell.
C - Indicates screening level
C
B = High Temperature Class B
C = Commercial
eA
All dimensions in inches
A
b
b2
C
D
E
e
eA
L
Q
S1
S2
X
Y
Z
0.175 (max)
0.018 ± 0.002
0.050 (typ)
0.010 to 0.002
1.400 ± 0.014
0.594 ± 0.010
0.100 ±0.005
0.600 ±0.010
0.125 to 0.175
0.050 ±0.010
0.005 (min)
0.005 (min)
0.100 ref
0.050 ref
0.075 ref
Helping You Control Your World
2
O
3
) and features internal