HCS166D INTERSIL [Intersil Corporation], HCS166D Datasheet
HCS166D
Related parts for HCS166D
HCS166D Summary of contents
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... C to +125 C MIL-STD-1835 CDFP4-F16, LEAD FINISH GND Ordering Information PART NUMBER HCS166DMSR HCS166KMSR HCS166D/ Sample HCS166K/ Sample HCS166HMSR 250 Radiation Hardened 8-Bit 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) TOP VIEW VCC ...
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Functional Diagram MASTER PARALLEL CLOCK RESET ENABLE ENABLE High Level L = Low ...
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Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL TPHL VCC = 4.5V TPLH TPHL VCC = 4.5V NOTES: 1. All voltages referenced to device GND measurements assume RL = 500 ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current IOH VCC ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTES: 1. Alternate Group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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AC Timing Diagrams and AC Load Circuit tr t/f MAX tPHL tPLH VS tTHL FIGURE 1. CLOCK PRE-REQUISITE TIMES AND PROPAGA- TION AND OUTPUT TRANSITION TIMES VALID DATA VS tSU FIGURE 3. DATA ...
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Die Characteristics DIE DIMENSIONS mils METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY < 2 A/cm BOND PAD SIZE: ...