HCS166D INTERSIL [Intersil Corporation], HCS166D Datasheet - Page 9
![no-image](/images/no-image-200.jpg)
HCS166D
Manufacturer Part Number
HCS166D
Description
Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
1.HCS166D.pdf
(9 pages)
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
94 x 94 mils
Type: AlSi
Metal Thickness: 11k
Type: SiO
Thickness: 13k
< 2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCS166 is TA14386A.
CE (6)
D2 (4)
D3 (5)
2
5
A/cm
Å
2
2.6k
Å
CP
(7)
Å
1k
Å
D1
(3)
GND
(8)
D0
(2)
HCS166MS
HCS166MS
258
MR
(9)
DS
(1)
(10)
D4
VCC
(16)
(11)
D5
(15)
PE
Spec Number
(14) D7
(13) Q7
(12) D6
518758