MMC2114 MOTOROLA [Motorola, Inc], MMC2114 Datasheet - Page 642
MMC2114
Manufacturer Part Number
MMC2114
Description
M CORE Microcontrollers
Manufacturer
MOTOROLA [Motorola, Inc]
Datasheet
1.MMC2114.pdf
(654 pages)
Available stocks
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Mechanical Specifications
24.6 Package Information for the 196-Ball MAPBGA
Advance Information
642
The production 196-pin package characteristics are:
•
•
•
•
•
•
Freescale Semiconductor, Inc.
For More Information On This Product,
JEDEC standard
196-ball plastic mold array process ball grid array (MAPBGA)
Dimension: 15 x 15
Ball pitch: 1 mm
Thickness: 1.6 mm
Case number: 1128C-02
Go to: www.freescale.com
Mechanical Specifications
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
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