STM1066C20F38F STMICROELECTRONICS [STMicroelectronics], STM1066C20F38F Datasheet - Page 15

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STM1066C20F38F

Manufacturer Part Number
STM1066C20F38F
Description
Smart voltage supervisor
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
STM1066
Package mechanical data
6
Package mechanical data
®
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 12. Flip chip 6-bump, package mechanical outline
Flip chip (6-bump)
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